Dual-Hand Substrate Transfer Layout for Warped Wafer Gripping
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Solution Overview
Problem
Existing substrate transfer apparatuses struggle to reliably grip warped or thick substrates due to limitations in pusher thickness and interference when multiple pushers are stacked vertically.
Innovation Solution
A substrate transfer apparatus with a first and second hand, each equipped with pushers that can grip substrates from different directions, allowing for thicker pushers without interference, and a lifting mechanism to adjust the relative positions of the hands in the vertical direction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pushers are made thicker in the vertical direction to grip warped or thick substrates, then gripping reliability is improved, but the pushers cannot be thickened because they are vertically stacked on top of each other
Solution Approach 1:
The patent transitions from vertical stacking of pushers to horizontal arrangement. The first pusher is disposed at the proximal end of the first blade, while the second pusher is disposed at the distal end of the first blade, spreading them apart in the horizontal direction rather than stacking them vertically. This dimensional change allows each pusher to have sufficient thickness for reliable gripping of warped or thick substrates without interference from other pushers.
2Productivity
If multiple pushers are vertically stacked to handle multiple substrates, then substrate transfer capacity is improved, but the pushers interfere with each other and cannot grip substrates reliably
Solution Approach 1:
The patent arranges multiple pushers horizontally along the first blade rather than stacking them vertically. The first pusher is at the proximal end and the second pusher is at the distal end of the first blade, creating spatial separation in the horizontal direction. This allows multiple substrates to be gripped simultaneously without interference, maintaining both high productivity and reliable gripping.
Solution Approach 2:
The patent divides the substrate handling function into multiple independent pushers positioned at different locations along the first blade. Each pusher can independently grip a different substrate, allowing simultaneous handling of multiple substrates. This segmentation enables the system to process multiple substrates in parallel without the pushers interfering with each other's gripping action.
Data Source
AI summary
A first hand includes a first pusher for gripping a substrate, the first pusher being provided at a proximal end of a branched blade and at a position sandwiched between a pair of first proximal end guides. A second hand includes a second pusher for gripping a substrate, the second pusher being provided at a position sandwiched between a pair of second proximal end guides. The first pusher includes a first member and a second member, against each of which the substrate comes into abutment, and the second pusher is provided at a position sandwiched between the first member and the second member.