Substrate Transport Layout With Overlapping Processing Units
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Solution Overview
Problem
Existing substrate processing apparatuses have limitations in throughput efficiency, necessitating improvements in the arrangement and transport mechanisms to enhance processing capacity.
Innovation Solution
The apparatus incorporates an indexer, slider, and bridge portions arranged in a horizontal direction, with overlapping processing units and transport mechanisms, allowing for high-density arrangement and efficient substrate transport between these components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the processing units and transport mechanisms are arranged in a conventional non-overlapping layout, then the structural complexity is reduced and ease of manufacture is improved, but the throughput and processing capacity are limited
Solution Approach 1:
The patent applies dimensional change by arranging processing units and transport mechanisms in overlapping positions in the vertical direction while maintaining separate operational spaces. Specifically, the first front processing unit is positioned to overlap with the slider portion in plan view, and the first rear processing unit overlaps with the bridge portion, enabling high-density three-dimensional arrangement that increases throughput without causing operational interference
Solution Approach 2:
The patent implements nesting by placing processing units within the spatial envelope of transport mechanisms. The processing units are positioned such that they occupy the same projected area as the transport mechanisms (slider and bridge portions) but operate at different vertical levels, effectively nesting functional elements within each other's spatial footprint to maximize space utilization
2Productivity
If processing units are arranged at high density with overlapping transport mechanisms, then throughput is improved, but the ease of operation and maintenance becomes more difficult
Solution Approach 1:
The patent divides the substrate processing system into distinct functional segments: the slider portion for front-to-rear transport, the bridge portion for lateral transport, and separately controlled processing units. Each segment operates independently with dedicated transport paths, allowing maintenance and operation of one segment without affecting others, thus maintaining ease of operation despite high-density arrangement
3Area of stationary object
If multiple processing units are positioned to overlap with transport mechanisms in plan view, then the area utilization is maximized and throughput increases, but the manufacturing precision requirements become more stringent
Solution Approach 1:
The patent resolves positioning precision challenges by transitioning from two-dimensional planar arrangement to three-dimensional spatial arrangement. Processing units and transport mechanisms overlap in the plan view (horizontal plane) but are separated in the vertical dimension, allowing maximum area utilization while maintaining adequate clearance for precise positioning and operation without excessive manufacturing tolerances
Data Source
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AI summary
The present invention relates to a substrate processing apparatus and a substrate processing method. A substrate processing apparatus includes an indexer portion, a slider portion, a bridge portion, a first front portion, and a first rear portion. The indexer portion, the slider portion, and the bridge portion are arranged in this order in a front-rear direction. The first front portion, the bridge portion, and the first rear portion are arranged in this order in the front-rear direction. The slider portion transports a substrate between the indexer portion and the bridge portion. The bridge portion transports the substrate between the slider portion and the first front portion. The bridge portion transports the substrate between the slider portion and the first rear portion. The first front portion includes a plurality of processing units. The first front portion includes a transport mechanism. The first rear portion includes a plurality of processing units. The first rear portion includes a transport mechanism. The slider portion overlaps with the processing units of the first front portion in plan view.