Substrate Transport Path Calculation for Plasma Processing
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Solution Overview
Problem
Existing substrate transportation methods in plasma processing apparatuses face challenges in efficiently calculating and managing the transportation path, leading to increased calculation loads, potential positional deviations, and interference risks with substrate carrying-in/out ports, especially when dealing with larger substrates and positional deviations.
Innovation Solution
A method that determines a substrate transportation path by calculating a first straight line, a circular arc, and a second straight line, allowing the substrate holding unit to move along these trajectories without changing the circular arc's radius, thereby simplifying path recalculations and maintaining consistent forces applied to the substrate, reducing interference risks with substrate carrying-in/out ports.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the transportation path is recalculated when the end point position changes, then the substrate can be transported to the new position, but the calculation load increases and the radius of the circular arc must be re-determined
Solution Approach 1:
The radius of the circular arc is determined in advance based on the start point and the initial end point position. When the end point position changes, this pre-determined radius is reused without recalculation, thereby reducing the calculation load while still adapting to the new position requirements
Solution Approach 2:
The system dynamically adjusts the transportation path by recalculating only the necessary parameters (such as the angle and contact points) while keeping the circular arc radius fixed. This allows the path to adapt to end point position changes without the complexity of re-determining the entire path geometry
2Adaptability or versatility
If the radius of the circular arc is changed during path recalculation, then the path can accommodate new end point positions, but the force applied to the substrate changes causing positional deviations
Solution Approach 1:
The radius of the circular arc is determined in advance and fixed before transportation begins. This pre-determination ensures that the force characteristics remain consistent throughout the motion, preventing positional deviations caused by changing forces while still allowing path recalculation for new end point positions
Solution Approach 2:
Instead of changing the radius parameter when the end point position changes, the system changes other parameters such as the angle of the circular arc and the contact points with the straight lines. This maintains the force consistency while achieving adaptability to new positions
3Productivity
If the substrate is transported along a path with changing circular arc radius, then the path can be optimized for new positions, but the substrate may interfere with the carrying-in/out ports
Solution Approach 1:
The radius of the circular arc is pre-determined to ensure consistent force application throughout the transportation path. This consistency prevents unexpected substrate movement or deviation that could lead to interference with the carrying-in/out ports, while still allowing efficient path optimization for new end point positions
Solution Approach 2:
The system uses feedback from the fixed radius constraint to maintain stable force application during transportation. This feedback mechanism ensures that the substrate remains properly positioned throughout the motion, preventing interference with the carrying-in/out ports while achieving efficient transportation
Data Source
AI summary
A substrate transportation path is determined by first determining a trajectory of a first straight line passing through a start point, calculating a trajectory of a circular arc in contact with the first straight line, calculating a trajectory of a second straight line in contact with the circular arc and passing through the end point, then, if the position of the end point is changed, re-calculating the second straight line as a straight line passing through the changed end point and in contact with the circular arc, and allowing the center of the substrate holding unit to move on the first straight line, and then, move on the circular arc from a first contact point, followed by moving on the second straight line from a second contact point so as to reach the end point.