Substrate Transport Robot Layout for Semiconductor Processing
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Solution Overview
Problem
The existing substrate treating apparatuses for semiconductor manufacturing have inefficiencies in substrate transport and processing due to high load on transport robots, particularly in the development and bake processes, which limits production rate.
Innovation Solution
The apparatus is designed with a distributed layout that includes multiple development treating chambers and path units, allowing for separate and optimized movement passages for transport robots to perform sequential processes like post exposure bake, cooling, and development, thereby reducing the load on individual robots and improving substrate handling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If multiple process steps are arranged on one layer for substrate treatment, then the apparatus structure is simplified, but the transport robot load increases and productivity decreases
Solution Approach 1:
The patent divides the substrate treatment apparatus into multiple layers (first layer and second layer) with separate transport robots for each layer. The development process is segmented into development module and heating module across different layers, distributing the workload from a single robot to multiple robots on different layers, thereby reducing individual robot load and improving productivity
Solution Approach 2:
The patent transitions from a single-layer horizontal arrangement to a multi-layer vertical arrangement. By stacking process modules and transport robots across multiple layers, the system utilizes the vertical dimension to increase throughput capacity without significantly increasing the horizontal footprint, enabling higher productivity while maintaining manageable robot loads
2Productivity
If process modules are arranged in divided layers, then robot load is reduced and production rate improves, but the apparatus layout becomes more complex
Solution Approach 1:
The patent segments the apparatus into distinct functional layers with dedicated transport robots for each layer. The development treating chamber is divided into development module and heating module on different layers, with each layer having its own transport robot, simplifying the control and operation of each individual robot while achieving high overall productivity
Solution Approach 2:
The transport robots are designed with multi-functionality to perform various operations including substrate transport, loading, and unloading at different positions. The index robot at the index unit can handle multiple substrates and coordinate with transport robots on different layers, reducing the need for specialized equipment and simplifying the overall system operation despite the multi-layer layout
3Ease of operation
If a single transport robot performs all development process steps, then the apparatus is simpler to operate, but the robot workload is excessive and efficiency is reduced
Solution Approach 1:
The patent divides the transport tasks into segments handled by different robots on different layers. The first transport robot on the first layer handles substrate loading and transport to the development module, while the second transport robot on the second layer handles substrate transport between development and heating modules. This segmentation reduces the step count and workload for each robot, improving efficiency while maintaining operational simplicity through standardized robot functions
Solution Approach 2:
The patent introduces buffer modules as intermediary storage positions between process modules. Substrates can be temporarily stored in buffer modules during temperature changes or process transitions, allowing transport robots to operate independently without waiting for other robots or processes, thereby improving robot efficiency and reducing operational complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the production rate by approximately 40% by optimizing the use of transport robots and reducing standby times during temperature changes, particularly in processes like negative development.
Implementation Method 1
a first heating module, and a second heating module... The first heating module may be a post exposure bake (PEB) module... The second heating module may be a hard bake (H/B) module
Implementation Method 2
a cooling module... performing a PEB process, a cooling process and a development process
Data Source
AI summary
A substrate treating apparatus according to the present invention includes: an index unit having an index robot and a port on which a container containing a substrate is placed; a process treating unit having a development treating unit in which a first development treating chamber and a second development treating chamber for performing a substrate development process are arranged in divided layers; and a first path unit arranged between the development treating unit and the index unit, wherein the first development treating chamber includes a development module, a first heating module, and a first main transport robot arranged in a movement passage accessible to the development module and the first heating module, wherein the first path unit includes a second heating module, a first buffer module, a cooling module, a second buffer module, and a first buffer transport robot arranged in a movement passage accessible to the second heating module, the first buffer module, the cooling module and the second buffer module.