Substrate Tray Design for AMB Ceramic Protection
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Solution Overview
Problem
Active metal brazing (AMB) substrates are prone to damage, scratches, and contamination during transportation and storage, which can lead to soldering defects in subsequent processes due to spatial limitations and the need for effective heat dissipation without separate cooling devices.
Innovation Solution
A substrate tray with a supportive design featuring a first opening for accommodating ceramic substrates, a peripheral support part with inner and outer walls, grip grooves, corner grooves, and protrusions to prevent impact and contamination, allowing for secure stacking without external sealing members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If AMB substrates are transported and stored without specialized packaging, then transportation and storage are simple and cost-effective, but the substrates are prone to damage, scratches, and contamination
Solution Approach 1:
The packaging container is divided into multiple compartments, each designed to hold a specific number of substrates (e.g., 10 substrates per container). This segmentation allows for modular packaging that provides adequate protection while maintaining simplicity and cost-effectiveness in transportation and storage.
2Temperature
If separate cooling devices are added to circuit boards for heat dissipation, then heat dissipation effectiveness is improved, but spatial limitations and device complexity increase
Solution Approach 1:
The AMB substrate serves multiple functions: it acts as both the circuit board and the heat dissipation component. The metal foil brazed to the ceramic substrate provides excellent thermal conductivity for heat dissipation, eliminating the need for separate cooling devices like heat sinks or cooling fans, thus reducing spatial requirements and device complexity while maintaining effective heat management.
Data Source
AI summary
A substrate tray for accommodating at least one ceramic substrate therein including: an accommodation part including a first opening part of which the upper side is open so that the ceramic substrate can be accommodated and withdrawn; and a support part formed on the circumference of the accommodation part so as to support the side wall circumference of the ceramic substrate, wherein the support part includes: an inner wall in contact with at least one surface of the ceramic substrate; an outer wall spaced a predetermined distance from the inner wall; an upper surface for connecting the inner wall to the outer wall; and a second opening part formed to be open in the direction opposite to the first opening part at a location facing the upper surface between the inner wall and the outer wall.