Substrate Processing Tray with Masked Edge Support
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Solution Overview
Problem
Thin semiconductor wafers are prone to breakage during processing due to edge contact with trays and electrostatic chucks, leading to potential damage or short circuits from fragments.
Innovation Solution
A substrate processing apparatus and method utilizing a ring-shaped tray with a substrate support and a mask support, where the substrate's outer edge is supported by the tray and covered by a ring-shaped mask, allowing the substrate to be adsorbed onto an electrostatic surface while the tray is mounted on a rotary stage, preventing fragments from causing damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the substrate outer edge portion contacts the tray for support, then the substrate can be held and processed, but the substrate outer edge portion is prone to breakage
Solution Approach 1:
The tray is divided into distinct functional regions: a substrate support region with recesses for holding the substrate, and a separate fragment collection region. This segmentation allows the substrate to be supported without direct contact between the outer edge and the tray surface, reducing breakage risk while maintaining holding capability.
Solution Approach 2:
The substrate support structure acts as an intermediary between the tray and the substrate. The recesses in the substrate support provide indirect support to the substrate outer edge portion, preventing direct contact and potential breakage while still maintaining proper substrate positioning and holding.
2Productivity
If substrate fragments are present on the transfer hand or electrostatic chuck, then the substrate can be processed, but the fragments may cause damage to the device formation surface or cause fracture in the wafer
Solution Approach 1:
The harmful substrate fragments are extracted from the processing area and isolated in dedicated fragment collection recesses on the tray. This prevents fragments from being transferred to the transfer hand or electrostatic chuck, eliminating the risk of fragment-induced damage to the device formation surface or wafer fracture during processing.
Solution Approach 2:
The fragment collection recesses, which initially seem to be simple structural features, are converted into beneficial fragment containment zones. By providing designated areas for fragment accumulation, the design transforms the potential harm of substrate breakage into a controlled situation where fragments are isolated and cannot cause damage to the substrate or processing equipment.
3Adaptability or versatility
If the electrostatic chuck surface is made of flexible material such as polyimide, then the chuck can conform to the substrate, but substrate fragments can dig into it and reach the electrostatic chucking electrode, causing short circuit
Solution Approach 1:
Substrate fragments are extracted from the potential contamination path and contained in fragment collection recesses on the tray before the substrate reaches the electrostatic chuck. This prevents fragments from reaching the flexible chuck surface and digging into the electrostatic chucking electrode, maintaining electrode integrity while preserving the chuck's conformability.
Solution Approach 2:
The fragment collection recesses provide beforehand protection by capturing substrate fragments before they can reach the electrostatic chuck. This prior cushioning measure prevents fragments from compromising the flexible chuck surface and electrostatic electrode, ensuring reliable operation while maintaining the chuck's adaptive conformability to the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents breakage and damage by containing fragments within the tray's recess and maintaining the substrate's integrity during processing and transfer, enhancing processing quality and reducing maintenance.
Implementation Method 1
a rotary stage including an electrostatic adsorption surface and a tray mounting portion provided on an outer periphery side of the electrostatic adsorption surface and below the electrostatic adsorption surface, the outer edge portion of the substrate being projected toward the tray mounting portion side from the electrostatic adsorption surface, the substrate support being spaced below the outer edge portion of the substrate and the mask being spaced above the outer edge portion; with the substrate being adsorbed onto the electrostatic adsorption surface
Data Source
AI summary
A substrate processing apparatus includes a tray, a mask and a rotary stage. The tray includes a substrate support configured to support an outer edge portion of a substrate, a mask support provided on an outer periphery side of the substrate support and projected above the substrate support, and a recess provided between the substrate support and the mask support. The mask covers the recess and the substrate support of the tray. The rotary stage includes an electrostatic adsorption surface and a tray mounting portion provided on an outer periphery side of the electrostatic adsorption surface and below the electrostatic adsorption surface. The outer edge portion of the substrate is projected toward the tray mounting portion side from the electrostatic adsorption surface. The substrate support is spaced below the outer edge portion of the substrate. The mask is spaced above the outer edge portion of the substrate.