Substrate Treating Device Concentration Control
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Solution Overview
Problem
In semiconductor wafer manufacturing, maintaining the concentration of treating liquids in etching tanks is challenging, especially during processes like three-dimensional NAND formation, where a large quantity of material is dissolved, leading to unstable concentrations and inadequate dissolution reactions.
Innovation Solution
A substrate treating device with a treating tank system that includes a supply unit for chemical liquids and pure water, a discharge unit, and a control unit to manage the liquid concentration, utilizing a circulation path with temperature and filtration to stabilize the treating liquid concentration and temperature, and a regeneration unit to reuse the liquid.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If total quantity replacement of treating liquid is performed to maintain concentration, then concentration stability is improved, but treatment time is increased and productivity is reduced
Solution Approach 1:
Instead of performing total quantity replacement of the treating liquid, the invention applies partial action by replenishing only the necessary amount of treating liquid to maintain concentration. The control unit calculates the required replenishment amount based on the relationship between lot size and concentration change, enabling concentration maintenance without complete liquid replacement, thus preserving productivity while ensuring concentration stability.
2Stability of the object's composition
If replenishment of treating liquid is performed during treatment to maintain concentration, then concentration stability is improved, but device complexity is increased
Solution Approach 1:
The invention implements a feedback control mechanism where the control unit continuously monitors treatment progress and lot size, calculates the resulting concentration change, and automatically determines the required replenishment amount. This closed-loop feedback system maintains concentration stability through intelligent calculation and automatic control, avoiding the need for complex additional hardware while achieving precise concentration management.
3Productivity
If large quantity of material is dissolved in one treatment, then productivity is improved, but concentration stability deteriorates
Solution Approach 1:
The invention applies preliminary action by calculating the expected concentration change before treatment begins, based on the lot size and dissolution characteristics. The control unit determines the optimal replenishment amount in advance and executes it at the appropriate time during treatment. This proactive approach allows large quantities of material to be dissolved efficiently while pre-compensating for concentration changes, maintaining both high productivity and concentration stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively stabilizes the treating liquid concentration, preventing rapid changes and ensuring consistent etching performance even during high-material-dissolution processes, while also reusing the liquid to reduce waste and costs.
Implementation Method 1
a circulation path for recirculating the treating liquid from the outer tank to the inner tank
Implementation Method 2
The circulation path may include a temperature adjuster that adjusts a temperature of the treating liquid inside the circulation path
Implementation Method 3
a filtering unit that filters the treating liquid passing through the circulation path
Implementation Method 4
A discharge unit that discharges the treating liquid stored in the treating tank
Data Source
AI summary
The substrate treating device performs a predetermined treatment on a substrate by immersing the substrate into a treating liquid that contains a predetermined chemical liquid and pure water. Further, the substrate treating device includes a treating tank in which a treating liquid with which a predetermined treatment is performed on the substrate is stored, a supply unit that supplies a chemical liquid or pure water to the treating tank, a discharge unit that discharges the treating liquid stored in the treating tank, and a control unit that controls supply of the treating liquid or the pure water by the supply unit. The control unit causes the supply unit to supply the chemical liquid or the pure water during performing the predetermined treatment.