Substrate Treating Apparatus for Precise Etching and Defect Reduction
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Solution Overview
Problem
The photolithography process for semiconductor wafers faces challenges in accurately inspecting and correcting critical dimensions of patterns on masks due to deviations between monitoring and anchor patterns, which can lead to incomplete etching and treatment defects from foreign substances and process impurities.
Innovation Solution
A substrate treating apparatus and method that involves pre-treating, etching, and post-treating the substrate in separate chambers, using hydrophilization, etching with laser irradiation, and ultrasound to remove residues, ensuring precise etching and minimizing defects by maintaining an optimal substrate state throughout the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the anchor pattern is etched to correct critical dimensions, then the critical dimension accuracy is improved, but foreign substances and process impurities are generated that cause treating defects
Solution Approach 1:
The patent divides the substrate treating process into multiple separate chambers: a first chamber for pre-treatment (cleaning), a second chamber for etching with critical dimension correction, and a third chamber for post-treatment. This segmentation allows each process step to be performed in an isolated environment, preventing contamination from one step affecting another, thus resolving the contradiction between achieving precise etching and generating harmful impurities.
Solution Approach 2:
The patent performs pre-treatment in the first chamber before the etching process to remove foreign substances and contaminants from the substrate surface. This preliminary cleaning action ensures that the subsequent etching process in the second chamber can proceed without generating defects from pre-existing contaminants, thereby enabling precise critical dimension correction without the harmful effects of foreign substances.
2Reliability
If multiple process steps are performed in separate chambers, then treating defects are minimized, but device complexity increases
Solution Approach 1:
The patent segments the substrate treating process into three functional chambers, each performing a specific operation (pre-treatment, etching, post-treatment). This segmentation improves reliability by isolating process steps and preventing cross-contamination. The modular chamber design allows for standardized construction and maintenance, mitigating the complexity increase through systematic organization of the multi-step process.
3Stability of the object's composition
If the substrate is transferred in wetted state, then pattern collapse is prevented, but drying time is required which reduces productivity
Solution Approach 1:
The patent performs pre-treatment and cleaning steps before the etching process, preparing the substrate in advance to prevent pattern collapse during subsequent operations. By completing the necessary preparation work beforehand, the substrate can be transferred in a stable state without requiring extended drying time between steps, thus maintaining both pattern stability and processing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for precise etching of specific regions on the substrate, reducing defects and ensuring accurate pattern correction, thereby enhancing the reliability and efficiency of the photolithography process.
Implementation Method 1
irradiating a laser to a specific region of the substrate in a state at which the etchant remains on the substrate to etch the specific region of the substrate
Implementation Method 2
applying an ultrasound to a substrate having the second treating liquid remaining thereon, to remove the rinsing liquid and an etching residue generated at the etching the substrate from the substrate
Data Source
AI summary
The inventive concept provides a substrate treating method. The substrate treating method includes pre-treating a substrate by cleaning the substrate; etching the substrate by supplying an etchant and heating a substrate supplied with the etchant; and post-treating the substrate after the etching the substrate, and wherein the pre-treating the substrate, the etching the substrate, and the post-treating the substrate are each performed in different chambers, a substrate on which the pre-treating the substrate is completed is transferred in a dry state to a chamber at which the etching the substrate is performed, and a substrate on which the etching the substrate is completed is transferred in a wetted state with a liquid to a chamber at which the post-treating the substrate is performed.