Substrate Treating Liquid Replacement for Pattern Collapse Prevention
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Solution Overview
Problem
Conventional substrate treating apparatuses cause pattern collapse on semiconductor substrates due to the high surface tension of deionized water, which remains in the minutia of patterns, leading to defective devices and reduced yield.
Innovation Solution
A substrate treating apparatus that uses a treating tank with a first liquid of high surface tension for cleaning, followed by a second liquid of lower surface tension and higher boiling point for evaporation, and optionally a third liquid of even lower surface tension for faster drying, to prevent pattern collapse by replacing the high surface tension liquid and facilitating efficient drying.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If deionized water is used for substrate cleaning, then cleaning effectiveness is improved, but pattern collapse occurs due to high surface tension
Solution Approach 1:
The patent changes the physical parameter of surface tension by switching from deionized water (high surface tension) to IPA liquid (low surface tension). This parameter change allows the liquid to penetrate pattern minutia without causing collapse, while still achieving effective cleaning through the low surface tension property.
Solution Approach 2:
The patent utilizes phase transition by heating the IPA liquid to a temperature above the boiling point of water but below the boiling point of IPA. This causes water to evaporate from the substrate while IPA remains in liquid state, enabling complete removal of water without pattern collapse.
2Object-affected harmful factors
If IPA liquid is used to replace deionized water, then pattern collapse is prevented, but complete replacement of water in pattern minutia is difficult
Solution Approach 1:
The patent changes the temperature parameter by heating the IPA liquid to a specific range (above water boiling point, below IPA boiling point). This temperature parameter change enables water to evaporate completely from pattern minutia while IPA remains liquid, achieving complete water replacement without pattern collapse.
Solution Approach 2:
The patent replaces the mechanical process of liquid replacement with a thermal process. Instead of relying on liquid flow to displace water, the system uses heat to evaporate water, substituting a thermal mechanism for a mechanical fluid displacement approach.
3Productivity
If substrates are pulled up from deionized water for drying, then drying is promoted, but pattern collapse occurs due to surface tension
Solution Approach 1:
The patent changes the surface tension parameter by using IPA liquid instead of deionized water. The low surface tension of IPA allows fast drying without the pattern collapse that occurs with high surface tension water, simultaneously achieving both high productivity and pattern integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively prevents pattern collapse by replacing deionized water with a low surface tension liquid, ensuring complete evaporation and reducing drying time, thereby maintaining substrate integrity and increasing yield.
Implementation Method 1
a second treating liquid supply device for supplying a second treating liquid of lower surface tension than the first treating liquid, and higher boiling point than the first treating liquid, into the treating tank; a temperature control device for controlling temperature of the second treating liquid in the treating tank to be in a temperature range above the boiling point of the first treating liquid and below the boiling point of the second treating liquid
Data Source
AI summary
A method for treating substrates with treating liquids, using a treating tank for storing the treating liquids, a holding mechanism for holding the substrates and placing the substrates in a treating position inside the treating tank, a first and a second treating liquid supply device, a temperature control device, and a control device. A first treating liquid is supplied into the treating tank, then a second treating liquid of lower surface tension and higher boiling point than the first treating liquid, is supplied into the treating tank, and placed in a temperature range above the boiling point of the first treating liquid and below the boiling point of the second treating liquid, and then controlling the second treating liquid supply device to replace the first treating liquid stored in the treating tank with the second treating liquid, and controlling the temperature control device to maintain the second treating liquid in the same said temperature range.