Substrate Treating Nozzle with Segmented Chemical Supply
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Solution Overview
Problem
Existing substrate treating processes, particularly in semiconductor manufacturing, face challenges in efficiently and uniformly treating substrates due to variations in chemical concentration and temperature across the substrate surface during etching and cleaning processes.
Innovation Solution
A substrate treating apparatus and method that utilize a spin head with a nozzle system to discharge chemicals with varying concentrations and temperatures, where the first chemical is more concentrated and hotter than the second, and is supplied in greater amounts to the outer areas of the substrate, while the second chemical is less concentrated and cooler, and is supplied in greater amounts to the central areas, using a circulation passage and heater to maintain chemical efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single chemical supply system is used for substrate treatment, then the device complexity is reduced, but the manufacturing precision of uniform chemical treatment across the substrate surface deteriorates
Solution Approach 1:
The chemical supply system is segmented into multiple independent passages (first passage for concentrated chemical, second passage for diluted chemical), allowing different chemical compositions to be supplied to different regions of the substrate simultaneously, thereby achieving uniform treatment across the entire substrate surface
Solution Approach 2:
Different regions of the substrate receive different chemical compositions tailored to their specific treatment needs - the first chemical with higher concentration is supplied to areas requiring stronger treatment, while the second chemical with lower concentration is supplied to areas requiring gentler treatment, achieving local optimization of treatment quality
2Productivity
If chemical concentration is increased to improve treatment efficiency, then the productivity is improved, but the manufacturing precision of uniform treatment across different substrate areas deteriorates
Solution Approach 1:
The system applies different chemical concentrations to different regions of the substrate based on treatment requirements - high concentration chemical is supplied to areas needing intensive treatment, while low concentration chemical is supplied to areas needing gentle treatment, thereby maintaining both high productivity and uniform treatment quality across the entire substrate
3Productivity
If chemical temperature is increased to improve reaction rate, then the productivity is improved, but the object-affected harmful factors increase due to potential substrate damage
Solution Approach 1:
Different temperature chemicals are supplied to different regions of the substrate according to treatment needs - higher temperature chemical is supplied to areas requiring faster reaction rates, while lower temperature chemical is supplied to areas sensitive to thermal damage, thereby optimizing both productivity and substrate protection locally
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures uniform and efficient treatment of substrates by adjusting chemical concentration and temperature based on the area of application, improving treatment quality by optimizing chemical exposure and reaction across the substrate surface.
Implementation Method 1
a heater located in the circulation passage
Implementation Method 2
spreading the chemical or the deionized water to the entire surface of the substrate by using a centrifugal force
Data Source
AI summary
Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating apparatus including a spin head configured to support the substrate, a nozzle configured to discharge a chemical to the substrate located on the spin head, a first passage configured to supply a first chemical, a chemical property of which is the same as the chemical, a second passage configured to supply a second chemical, a chemical property of which is the same as the first chemical, and a discharge passage connecting the first passage and the second passage, and the nozzle.