Substrate Surface Treating Solution for Cleaning Film Peeling
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Solution Overview
Problem
Conventional substrate cleaning methods face challenges such as incomplete removal of cleaning films, damage to hydrophobic regions, and inefficiencies in particle removal, especially on substrates with uneven surfaces, leading to potential chemical and electrical property alterations.
Innovation Solution
A substrate surface treating solution comprising a basic compound and a solvent is applied to form a treatment layer, followed by a cleaning film formation and removal using specific removers, allowing for efficient and complete film removal without damaging the substrate, even on hydrophobic or uneven surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a substrate cleaning film is used to hold particles, then particle removal is achieved, but the cleaning film may not be peeled off well on hydrophobic regions
Solution Approach 1:
A surface treatment layer comprising a basic compound is introduced as an intermediary between the substrate and the cleaning film. This treatment layer modifies the substrate surface properties, creating a hydrophilic region that enhances the peeling performance of the cleaning film while maintaining particle holding capability
Solution Approach 2:
The invention changes the surface energy parameters of the substrate by applying a basic compound treatment. This parameter change transforms hydrophobic regions into hydrophilic regions, enabling proper cleaning film peeling and particle removal
2Productivity
If a highly soluble remover is used to remove the cleaning film, then film removal efficiency is improved, but the film itself may break and release particles
Solution Approach 1:
The surface treatment layer is applied in advance to modify the substrate surface before cleaning film formation. This preliminary action creates optimal surface conditions that enable controlled film peeling with highly soluble removers without film breakage
Solution Approach 2:
The basic compound treatment layer acts as a mediator that controls the interaction between the remover and the cleaning film, allowing efficient removal while maintaining film integrity for particle containment
3Reliability
If conventional cleaning methods are used, then particles can be removed, but the chemical and electrical properties of the substrate surface may change
Solution Approach 1:
The invention uses a disposable surface treatment layer of basic compound that is removed after cleaning. This temporary layer enables effective particle removal and cleaning film peeling without permanent alteration of the substrate's chemical and electrical properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively removes particles and cleaning films from substrates, preventing film breakage and maintaining the chemical and electrical properties of the substrate surface, while reducing the contact angle and ensuring efficient film removal.
Implementation Method 1
making the substrate cleaning film easily peeled off... make lower the contact angle of the substrate surface
Implementation Method 2
forming a substrate surface treatment layer containing at least a part of the basic compound
Implementation Method 3
forming a substrate cleaning film from the substrate cleaning solution
Implementation Method 4
removing the substrate cleaning film with a remover
Data Source
AI summary
To provide a substrate surface treating solution for efficiently cleaning a substrate. [Means for Solution] The substrate surface treating solution according to the present invention is a substrate surface treating solution comprising a basic compound (A) and a solvent (B), and the substrate surface treating solution is applied on a substrate to form a substrate surface treatment layer containing at least a part of the basic compound (A), and a substrate cleaning solution is applied on the substrate surface treatment layer and used for forming a substrate cleaning film.