Substrate Treating Apparatus Temperature Control and Rinsing
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Solution Overview
Problem
Existing substrate treating apparatuses face challenges in achieving uniform treatment due to temperature differences between the treatment solution and the substrate, leading to variations in treatment amounts, and have issues with residual chemical solutions causing contamination and increased manufacturing costs.
Innovation Solution
A substrate treating apparatus with a rotating and holding unit, separate supply sources for pure water at different temperatures, and a heat control unit to manage temperature distribution across the substrate, along with a lower nozzle design that facilitates efficient rinsing and reduces residual chemical solutions by varying flow rates and nozzle geometry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If temperature control units are individually controlling temperatures of fluids supplied from a large number of points below the substrate, then temperature difference of the substrate is reduced, but apparatus manufacturing cost increases and device complexity increases
Solution Approach 1:
The substrate surface is divided into multiple regions (central region and peripheral region), and different temperature control strategies are applied to each region. The fluid supply is segmented into multiple discharge ports arranged in a specific pattern, allowing differential temperature control without requiring individual control units for every point.
Solution Approach 2:
Different temperatures are supplied to different regions of the substrate based on their specific requirements. The central region receives fluid at one temperature while the peripheral region receives fluid at a different temperature, optimizing treatment uniformity without requiring complex individual control for every location.
2Manufacturing precision
If treatment solution is emitted to the upper surface of the substrate while rotating the substrate, then treatment uniformity is affected by circumferential velocity difference, but treatment amount varies due to temperature difference between treatment solution and substrate
Solution Approach 1:
The system creates thermal equilibrium between the treatment solution and substrate by controlling the temperature of fluids supplied to the substrate. By pre-heating or cooling the fluids to match the substrate temperature, the system eliminates temperature gradients that would otherwise cause non-uniform treatment.
Solution Approach 2:
The temperature parameter of the treatment solution is dynamically adjusted to match the substrate temperature at different regions. By changing the temperature parameter of the fluid based on position (central vs peripheral regions), the system maintains optimal treatment conditions throughout the substrate.
3Productivity
If lower nozzle has wing shape with curved surfaces to rectify airflow and increase flow rate, then chemical solution and rinse solution are diffused smoothly, but residual chemical solution remains in the nozzle causing contamination
Solution Approach 1:
The curved surfaces of the lower nozzle that initially caused solution retention are redesigne dwith drainage holes and grooves. The same curved geometry that provided smooth diffusion is now combined with features that actively drain residual solution, converting the harmful retention effect into a beneficial drainage function.
Solution Approach 2:
The lower nozzle incorporates drainage holes and grooves that allow residual chemical solution to be efficiently drained from the nozzle structure. These porous-like features enable the nozzle to self-clean by allowing trapped solution to escape through the designed openings.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves uniform temperature distribution and treatment amounts across the substrate, reduces residual chemical solutions, and lowers manufacturing costs by independent heat control and efficient rinsing mechanisms.
Implementation Method 1
An airflow cutting across the lower nozzle and flowing in the direction of rotation of the substrate is formed below the substrate
Implementation Method 2
The flow rate also increases thanks to the diaphragm effect
Implementation Method 3
The chemical solution and the rinse solution, discharged from the lower nozzle to the lower surface of the substrate in the chemical solution treatment and the rinsing treatment, are diffused smoothly along the lower surface of the substrate through the airflow
Implementation Method 4
rotates the substrate at high speed to perform a drying treatment of drying the substrate by draining out the liquid adhering to the substrate
Data Source
AI summary
A substrate treating apparatus includes a rotating and holding unit that rotates a substrate, a first supply source that supplies first pure water having a first temperature, a second supply source that supplies second pure water having a second temperature higher than the first temperature, a treatment solution supply unit that supplies a treatment solution to a central section of an upper surface of the substrate, a first supply unit that supplies a first liquid containing the first pure water to a central section of a lower surface of the substrate, a second supply unit that supplies a second liquid containing the second pure water to a peripheral section and an intermediate section of the lower surface, and a heat amount control unit that independently controls an amount of heat to be supplied by the first supply unit and an amount of heat to be supplied by the second supply unit.