Substrate Treatment Gas Supply Layout for Mist Control
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Solution Overview
Problem
In semiconductor and liquid crystal display manufacturing, the cleaning process generates mist that contaminates peripheral devices and is sensitive to temperature and humidity, requiring a controlled environment which existing systems fail to maintain effectively.
Innovation Solution
An apparatus with a housing that includes a substrate support unit, a liquid supply unit, and an air flow generation unit, featuring a first gas supply for descending air flow and a second gas supply unit for temperature-humidity adjustment, where the second gas supply is positioned to avoid direct contact with the substrate, ensuring smooth air flow and controlled humidity without affecting the liquid treatment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a discharge member is disposed below the fan filter unit to supply temperature-humidity gas, then the temperature-humidity gas can be supplied to the substrate, but the discharge member blocks the descending air flow path and prevents smooth air flow
Solution Approach 1:
The patent relocates the temperature-humidity gas supply units from a vertical arrangement (below the fan filter unit) to a horizontal arrangement (side walls of the housing). This dimensional change allows the temperature-humidity gas to be supplied without blocking the descending air flow path, resolving the conflict between temperature control and air flow efficiency.
Solution Approach 2:
The patent separates the functions of descending air flow supply and temperature-humidity gas supply into distinct units positioned at different locations. The fan filter unit supplies descending air flow from above, while multiple gas supply units positioned on side walls supply temperature-humidity gas, eliminating the blocking issue.
2Stability of the object's composition
If the discharge member directly faces the substrate to supply temperature-humidity gas, then the substrate environment can be controlled, but the liquid supplied to the substrate is directly affected by the temperature-humidity gas causing instability
Solution Approach 1:
The patent positions temperature-humidity gas supply units on side walls rather than directly facing the substrate. This creates localized gas supply zones that gradually influence the overall environment without directly impacting the liquid treatment process on the substrate, maintaining both environmental stability and process reliability.
3Adaptability or versatility
If multiple gas supply units are positioned to supply both descending air flow and temperature-humidity gas, then both functions can be achieved, but the device complexity increases
Solution Approach 1:
The housing structure serves multiple functions: it contains the process space, provides mounting positions for gas supply units, and directs gas flows. The side wall positions serve dual purposes as both structural elements and gas supply locations, reducing the need for separate complex components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus prevents mist contamination and maintains a stable temperature-humidity environment, ensuring effective cleaning of substrates without direct exposure to temperature-humidity gases, thus optimizing the cleaning process.
Implementation Method 1
a first gas supply unit supplying a descending air flow of a first gas in the process space
Implementation Method 2
a second gas supply unit supplying a second gas having lower humidity than the first gas in the space
Data Source
AI summary
Embodiments of the inventive concept provides an apparatus for treating a substrate. The apparatus for treating a substrate comprises a housing having a process space therein, a substrate support unit supporting a substrate in the space, a liquid supply unit supplying a liquid to a substrate supported by the substrate support unit, an air flow generation unit generating an air flow in the process space, and the air flow generation unit comprises a first gas supply unit supplying a descending air flow of a first gas in the process space and a second gas supply unit supplying a second gas having lower humidity than the first gas in the space, and when viewed from above, the first gas supply unit and the second gas supply unit are not overlapped each other.