Substrate Treatment Device for Uniform Metal Particle Crystallization
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Solution Overview
Problem
Current techniques face challenges in effectively supplying and crystallizing metal particles on semiconductor substrates, particularly in achieving uniform particle size and preventing contamination in the substrate treatment process.
Innovation Solution
A substrate treatment device and method that includes a dilutor for diluting a metal ion-containing acidic liquid and a pH changer to adjust the pH, ensuring appropriate supply and crystallization of metal particles on semiconductor substrates, utilizing a device configuration with separate mixing and pH adjustment units to prevent contamination and achieve uniform particle size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If metal particles are supplied to semiconductor substrates using conventional methods, then crystallization of amorphous silicon layers can be achieved, but uniform particle size and contamination control become difficult
Solution Approach 1:
The patent applies parameter changes by controlling pH levels and metal ion concentrations in the liquid solution to achieve uniform metal particle formation. By adjusting these chemical parameters, the system produces particles with consistent size distribution without requiring complex mechanical particle generation equipment.
Solution Approach 2:
The invention replaces mechanical particle generation and size control systems with a chemical approach. Instead of using mechanical means to create and size-control metal particles, the system uses chemical reactions in liquid solution governed by pH and concentration parameters to produce uniformly sized particles.
2Quantity of substance
If acidic metal ion-containing liquid is used directly for substrate treatment, then metal particles can be supplied, but contamination of the substrate and environment occurs
Solution Approach 1:
The patent changes the pH parameter of the liquid solution to control the formation and supply of metal particles. By adjusting pH levels, the system optimizes metal particle supply efficiency while controlling contamination, as the chemical state of metal ions changes with pH affecting both particle formation and substrate interaction.
Solution Approach 2:
The system implements feedback control by monitoring and adjusting pH and metal ion concentration parameters to maintain optimal conditions for particle supply while preventing contamination. This closed-loop approach ensures that metal particles are supplied efficiently without exceeding contamination thresholds.
3Reliability
If separate mixing and pH adjustment units are used, then contamination is prevented and particle uniformity is achieved, but device complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the substrate treatment system into separate functional units: a mixing unit for combining metal ion solutions and a pH adjustment unit for controlling acidity. This segmentation prevents cross-contamination between functions and allows independent optimization of each unit, improving overall reliability despite increased device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient and uniform supply of metal particles to semiconductor substrates, promoting crystallization of amorphous silicon layers into polysilicon with large grain sizes, while minimizing device contamination and environmental impact.
Implementation Method 1
a dilutor configured to dilute a first liquid containing a metal ion and exhibiting acidity
Implementation Method 2
a pH changer configured to change a pH of the first liquid before or after being diluted by the dilutor
Implementation Method 3
supplying a metal to a channel semiconductor layer of a semiconductor memory and crystallizing the channel semiconductor layer
Implementation Method 4
a substrate conditioner configured to treat a substrate using the first liquid, which is diluted by the dilutor and with the pH changed by the pH changer
Data Source
AI summary
According to an embodiment, the substrate treatment device includes a dilutor configured to dilute a first liquid containing a metal ion and exhibiting acidity. The device further includes a pH changer configured to change a pH of the first liquid before or after being diluted by the dilutor. The device further includes a substrate conditioner configured to treat the substrate using the first liquid, which is diluted by the dilutor and with the pH changed by the pH changer.