Substrate Treatment Apparatus Uniform Peeling via Multi-Nozzle Stripping
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Solution Overview
Problem
Conventional substrate cleaning processes face issues with low wetting uniformity and uneven peeling of coating films, leading to incomplete removal of particles from the substrate surface.
Innovation Solution
A substrate treatment apparatus and method involving a three-nozzle system where a first liquid forms a coating film, a second liquid (in aerosol form or with compressed air) peels the film uniformly across the entire substrate surface, and a third liquid rinses any remaining film, improving wetting uniformity and complete film removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a stripper is provided to a central portion of the substrate, then the device complexity is reduced, but the wetting uniformity becomes low
Solution Approach 1:
The stripper supply system is segmented into multiple nozzles positioned at different locations (central and peripheral) to cover the entire substrate surface. This segmentation allows uniform distribution of stripper across the substrate while maintaining manageable device complexity through modular nozzle arrangement.
Solution Approach 2:
Different regions of the substrate receive stripper through locally optimized nozzle positions and spray patterns. The central nozzle addresses the center region while peripheral nozzles address edge regions, ensuring each area receives adequate stripper coverage for uniform wetting and peeling.
2Device complexity
If a stripper is provided to a central portion of the substrate, then the device complexity is reduced, but the peeling uniformity becomes uneven
Solution Approach 1:
The peeling process is segmented into multiple zones covered by different nozzles. The central nozzle provides stripper to the center region while peripheral nozzles cover the edges, ensuring uniform peeling across the entire substrate surface and preventing residual coating film in any region.
Solution Approach 2:
Each nozzle is positioned to provide localized stripper supply to specific regions of the substrate. This local quality approach ensures that each area receives appropriate stripper coverage for complete and uniform peeling of the coating film across the entire substrate.
3Manufacturing precision
If the second liquid is sprayed using compressed air in aerosol form, then the wetting uniformity is improved, but the use of energy increases
Solution Approach 1:
Compressed air is utilized to generate aerosol spray from the nozzles, improving wetting uniformity through fine droplet distribution. The pneumatic system efficiently converts compressed air energy into effective spray patterns that enhance stripper distribution across the substrate surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method ensures uniform peeling and complete removal of the coating film across the substrate surface, enhancing cleaning efficiency and consistency.
Implementation Method 1
discharging a first liquid onto a substrate by using a first nozzle, and forming a coating film collecting particles by using the first liquid
Implementation Method 2
spraying a second liquid on the substrate by using a second nozzle, and peeling the coating film from the substrate by using the second liquid
Implementation Method 3
discharging a third liquid onto the substrate by using a third nozzle, and rinsing the coating film from the substrate by using the third liquid
Implementation Method 4
spraying a second liquid on the substrate by using a second nozzle, and peeling the coating film from the substrate by using the second liquid... In the peeling of the coating film, the second liquid may be sprayed in the form of an aerosol... The second liquid may be sprayed using compressed air. The second liquid may have a direction of movement changed by the compressed air.
Data Source
AI summary
Provided are a substrate treatment apparatus and method for treating a substrate by simultaneously providing a stripper for peeling a coating film on the substrate to an entire surface of the substrate. The substrate treatment method includes discharging a first liquid onto a substrate by using a first nozzle, and forming a coating film collecting particles by using the first liquid; spraying a second liquid on the substrate by using a second nozzle, and peeling the coating film from the substrate by using the second liquid; and discharging a third liquid onto the substrate by using a third nozzle, and rinsing the coating film from the substrate by using the third liquid, wherein in the peeling of the coating film, the second liquid is simultaneously sprayed on an entire surface of the substrate.