Substrate Treatment Nozzle Segmentation for Etching Width Control
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Solution Overview
Problem
Existing substrate treatment apparatuses face challenges in precisely controlling the treatment width on the peripheral portions of substrates due to instability in etching liquid flow rates and variations in hydrophilicity of the substrate surfaces, leading to uneven etching or cleaning processes.
Innovation Solution
A substrate treatment apparatus with a first nozzle that fills the space between the substrate's lower surface and its opposing face with treatment liquid, ensuring uniform coverage and flow, and a second nozzle for precise control of the treatment liquid on the upper surface, maintaining a constant flow rate and preventing interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a center axis nozzle is used to supply etching liquid to the lower surface of the wafer, then the etching liquid can spread radially and reach the peripheral portion, but it is difficult to precisely control the treatment width due to flow rate instability and surface hydrophilicity variations
Solution Approach 1:
The treatment liquid supply system is divided into two independent nozzles: a first nozzle that supplies treatment liquid to the lower surface of the substrate, and a second nozzle that supplies treatment liquid to the upper surface peripheral portion. This segmentation allows independent control of each nozzle's flow rate and positioning, enabling precise control of the treatment width without being affected by flow rate instability in a single supply system
Solution Approach 2:
The first nozzle acts as an intermediary by supplying treatment liquid to the lower surface, which then flows around to the upper surface peripheral portion. This intermediary supply method ensures stable and uniform treatment liquid supply to the treatment region, preventing direct interference with the second nozzle's supply and maintaining consistent flow rate throughout the process
2Manufacturing precision
If the etching liquid flow rate is increased to ensure adequate coverage, then uniform treatment can be achieved, but treatment liquid may scatter onto the device formation region causing contamination
Solution Approach 1:
By segmenting the treatment liquid supply into two separate nozzles with distinct target regions, each nozzle can be optimized to supply treatment liquid precisely where needed. The first nozzle targets the lower surface while the second nozzle targets the upper surface peripheral portion, ensuring adequate coverage without excessive flow that would cause scattering onto the device formation region
Solution Approach 2:
Each nozzle is positioned and configured to supply treatment liquid to specific local regions: the first nozzle supplies to the lower surface area and the second nozzle supplies to the upper surface peripheral portion. This local quality approach ensures treatment liquid is delivered exactly where required, maintaining uniform treatment while preventing scattering into areas that should not be treated
3Device complexity
If a single nozzle supplies treatment liquid to both upper and lower surfaces, then the structure is simple, but the treatment width cannot be precisely controlled due to interference between flow paths
Solution Approach 1:
The single nozzle structure is segmented into two separate nozzles: a first nozzle for supplying treatment liquid to the lower surface and a second nozzle for supplying treatment liquid to the upper surface peripheral portion. This segmentation eliminates interference between flow paths while maintaining relatively simple overall structure, enabling precise control of treatment width through independent positioning and flow rate control of each nozzle
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for precise control of the treatment width on the substrate's peripheral portions, ensuring uniform treatment and preventing unwanted scattering of treatment liquid onto the device formation region, thus enhancing the accuracy and effectiveness of the etching or cleaning process.
Implementation Method 1
When the treatment liquid reaches the lower surface of the substrate, the treatment liquid receives a centrifugal force to spread outward radially about a rotation center, and flows around to an upper surface of the substrate from a peripheral edge of the substrate
Data Source
AI summary
A substrate treatment method includes a substrate holding unit which horizontally holds a substrate; a rotating unit which rotates the substrate held by the substrate holding unit about a vertical axis; and a first nozzle having an opposing face to be opposed to a lower surface of the substrate inward of a peripheral portion of the substrate in spaced relation to the lower surface of the substrate during rotation of the substrate by the rotating unit and a treatment liquid spout provided in the opposing face for filling a space defined between the lower surface of the substrate and the opposing face with a treatment liquid spouted from the treatment liquid spout to keep the space in a liquid filled state; wherein the treatment liquid spreads outwardly over the lower surface of the substrate and further, flows around to a peripheral portion of an upper surface of the substrate.