Multi-Wavelength Substrate Treatment for Pattern-Safe Drying
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Solution Overview
Problem
As critical dimensions of patterns on substrates are scaled down, the spin dry method leads to a leaning phenomenon and inadequate removal of organic matter, affecting substrate treatment efficiency in semiconductor manufacturing processes.
Innovation Solution
A substrate treating apparatus and method utilizing a light treatment chamber with multiple light sources of different wavelengths, including flash, infrared, and ultraviolet lamps, to irradiate light and effectively remove organic matter, potentially followed by supercritical or liquid treatment steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If spin dry method is used to dry the substrate, then drying efficiency is improved, but pattern collapse or bending occurs due to centrifugal force
Solution Approach 1:
The patent replaces the mechanical spin dry method with a thermal field-based drying method. Multiple light sources (infrared lamps, flash lamps) irradiate the substrate to evaporate remaining liquid through thermal energy, eliminating the need for centrifugal force and preventing pattern collapse while maintaining drying efficiency
Solution Approach 2:
The patent changes the drying mechanism from mechanical (centrifugal force) to thermal (light irradiation). By controlling the intensity and wavelength of light sources, the drying process achieves high efficiency without the harmful mechanical stresses that cause pattern deformation
2Speed
If spin dry method is used, then drying speed is improved, but organic matter removal becomes inadequate
Solution Approach 1:
The patent replaces mechanical drying with photochemical and thermal treatment. Ultraviolet lamps generate reactive oxygen species that oxidize and remove organic matter, while infrared and flash lamps provide thermal energy for evaporation, achieving both high-speed drying and effective contamination removal
Solution Approach 2:
The patent uses ultraviolet irradiation to generate reactive oxygen species (ozone, atomic oxygen) that act as strong oxidants. These species rapidly decompose and remove organic matter from the substrate surface, solving the contamination problem while maintaining fast processing speed
3Productivity
If multiple light sources with different wavelengths are used, then organic matter removal efficiency is improved, but device complexity increases
Solution Approach 1:
The patent divides the light treatment function into multiple specialized light sources, each targeting specific aspects of organic matter removal. Ultraviolet lamps handle photochemical oxidation, infrared lamps provide thermal energy, and flash lamps deliver high-intensity pulsed energy, allowing each component to be optimized independently
Solution Approach 2:
The patent creates a multi-functional irradiation system where different light sources work together to achieve multiple objectives: UV for chemical oxidation, infrared for heating, and flash for high-energy treatment. This integrated approach handles diverse organic contaminants through a single unified treatment chamber
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method efficiently removes organic matter from substrates, improving treatment efficiency and preventing pattern collapse or bending, while allowing for precise control over light exposure and substrate processing.
Implementation Method 1
a first light source that irradiates first light to the substrate
Implementation Method 2
a second light source that irradiates, to the substrate, second light having a different wavelength range from the first light
Implementation Method 3
the second light source may be one of an infrared lamp and an ultraviolet lamp
Implementation Method 4
The organic solvent on the substrate is dried by supplying the supercritical fluid
Data Source
AI summary
An apparatus for treating a substrate includes a light treatment chamber having an interior space, a support unit that supports the substrate in the interior space, and an irradiation unit that irradiates light to the substrate in the interior space to remove organic matter remaining on the substrate, in which the irradiation unit includes a first light source that irradiates first light to the substrate and a second light source that irradiates, to the substrate, second light having a different wavelength range from the first light.