Substrate Surface Treatment Sequence for Uniform Photoresist Heating
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Solution Overview
Problem
Contamination of substrate surfaces during semiconductor manufacturing leads to uneven heating and decreased productivity, causing issues such as insufficient temperature rise and cross-contamination in process equipment.
Innovation Solution
A substrate processing system and method that includes surface treatment chambers to clean both surfaces of the substrate before and after applying photoresist, followed by controlled exposure and development processes to form a photoresist pattern, thereby reducing contamination and ensuring uniform heating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If surface treatment is performed only before photoresist coating, then the substrate surface is cleaned initially, but contamination occurs during the process leading to uneven heating and decreased productivity
Solution Approach 1:
The patent applies surface treatment not only before photoresist coating but also after etching and before exposure. This preliminary and intermediate cleaning action removes particles deposited during etching, preventing heating uniformity issues and ensuring reliable photolithography processing throughout the manufacturing sequence.
Solution Approach 2:
The patent maintains continuous surface treatment by performing cleaning operations at multiple stages (before coating, after etching, before exposure) rather than a single initial treatment. This continuous action ensures the substrate surface remains free of contamination throughout the entire photolithography process, maintaining both heating uniformity and productivity.
2Productivity
If particles remain on the substrate surface during manufacturing, then the process continues without interruption, but contamination leads to insufficient temperature rise and uneven heating
Solution Approach 1:
The patent performs surface treatment after etching and before exposure as a preliminary cleaning action. This removes particles deposited during the etching process, ensuring the substrate surface is free from contamination that would cause uneven heating during subsequent thermal processing steps.
Solution Approach 2:
The patent implements intermediate surface treatment based on the process sequence, where contamination from etching is detected and corrected by surface treatment before the exposure step. This feedback mechanism ensures temperature uniformity is maintained by addressing contamination issues at the appropriate process stage.
3Reliability
If multiple surface treatments are performed on the substrate, then contamination is reduced and heating uniformity is improved, but the process complexity and time increase
Solution Approach 1:
The patent strategically places surface treatment operations at specific preliminary stages (before coating, after etching, before exposure) rather than continuously. This targeted approach maintains heating uniformity by cleaning at critical points without requiring complex continuous treatment systems.
Solution Approach 2:
The patent applies surface treatment locally at specific process stages where contamination is most likely to occur (after etching, before exposure). This localized treatment approach maintains reliability by addressing contamination at critical points while avoiding unnecessary complexity in non-critical areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents uneven heating and cross-contamination, enhancing productivity by maintaining consistent temperature distribution and reducing particle-induced defects in the manufacturing process.
Implementation Method 1
radiating light towards the photoresist film to form a photoresist pattern area
Data Source
AI summary
Provided is a substrate processing method, including performing a first surface treatment on a first surface of a substrate, subsequently applying a photoresist film on a second surface of the substrate, subsequently performing a second surface treatment on the first surface of the substrate, after performing the second surface treatment, radiating light towards the photoresist film to form a photoresist pattern area, and forming a photoresist pattern by removing from the photoresist film an area of the photoresist film other than the photoresist pattern area to form a photoresist pattern.