Substrate Treatment Apparatus Vertical Transfer Drying
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Solution Overview
Problem
Existing substrate treatment apparatuses face contamination issues during drying treatments due to chemical solution mist floating around the spin chuck, leading to particle formation and substrate contamination, as well as difficulty in completely removing dried chemical solutions from the treatment chamber.
Innovation Solution
A substrate treatment apparatus with separate chemical solution treatment and drying treatment areas, where the substrate is vertically moved between these areas, and a gas supply mechanism maintains a positive pressure in the drying area with low-humidity gas to prevent mist infiltration and particle formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If the substrate is dried in the chemical solution treatment area, then the drying treatment can be performed without moving the substrate, but chemical solution mist will contaminate the substrate and form particles
Solution Approach 1:
The treatment chamber is divided into two separate areas: a chemical solution treatment area and a drying treatment area. The substrate holding member can be positioned in either area, allowing the drying treatment to be performed in a dedicated environment free from chemical solution mist, thus preventing contamination while minimizing substrate movement time.
2Object-affected harmful factors
If an FFU is provided on the top face of the treatment chamber to supply downflow air, then chemical solution mist can be prevented from flying, but turbulence may form and mist may still fly if air supply and exhaustion are unbalanced
Solution Approach 1:
The drying treatment is extracted from the chemical solution treatment area and performed in a separate drying treatment area. This eliminates the need for complex air supply and exhaustion balancing to prevent mist contamination, as the substrate is simply moved to an area where no chemical solution treatment occurs. The gas supply mechanism provides a simple and reliable positive pressure environment without requiring precise balancing.
3Object-affected harmful factors
If the cup is periodically cleaned to remove dried chemical solution, then contamination can be reduced, but it is difficult to completely remove the chemical solution
Solution Approach 1:
The drying treatment is extracted from the chemical solution treatment area, and the substrate is moved to a separate drying treatment area. This prevents dried chemical solution on the cup wall from contaminating the substrate, as the substrate does not remain in the chemical solution treatment area during drying. The problem of completely removing chemical solution from the cup is avoided by spatial separation rather than relying on cleaning effectiveness.
4Ease of operation
If the substrate is held horizontally on a spin chuck, then chemical solution can be supplied and spread by centrifugal force, but the substrate must be moved vertically between treatment and drying areas
Solution Approach 1:
The substrate holding member is designed with vertical movement capability, allowing it to dynamically transition between the chemical solution treatment area and the drying treatment area. This dynamic positioning enables the substrate to be held horizontally for chemical solution treatment, then moved vertically to the drying area, and moved back if needed, optimizing both treatment effectiveness and operational flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents substrate contamination by ensuring the drying treatment occurs in an atmosphere free from chemical solution mist and dried residues, reducing particle formation and maintaining a clean environment for subsequent substrates.
Implementation Method 1
a gas supply mechanism supplying low-humidity gas into the drying treatment area
Implementation Method 2
the chemical solution supplied onto the surface of the substrate spreads on the entire region of the surface of the substrate due to centrifugal force resulting from the rotation of the substrate
Implementation Method 3
the DIW adhering to the substrate is drained and removed by high-speed rotation of the substrate
Data Source
AI summary
A substrate treatment apparatus includes: a treatment chamber provided therein with a chemical solution treatment area for treating a substrate with a chemical solution and a drying treatment area provided above the chemical solution treatment area for drying the substrate; a substrate holding member vertically movably provided in the treatment chamber for holding the substrate; and a lifting mechanism vertically moving the substrate in the range between the chemical solution treatment area and the drying treatment area.