Substrate Posture Turning Chuck for Stable Wafer Transfer
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Solution Overview
Problem
Conventional substrate processing apparatuses face difficulties in stabilizing the posture turn of substrates during transfer, particularly due to limited vertical movement in the locking groove of the reversing chuck, making it challenging to control the substrate's horizontal posture effectively.
Innovation Solution
The apparatus includes a posture turning unit with a reversing chuck that adjusts its position to accommodate substrates in a narrow interval for stable turning and a wider interval for easy transfer, utilizing a two-stage groove system and alignment bars to securely hold and move substrates, allowing for stable posture conversion and transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the locking groove is designed to clamp the substrate tightly for stable posture turning, then the substrate positioning stability is improved, but the substrate cannot move vertically enough to facilitate easy transfer to the next processing unit
Solution Approach 1:
The reversing chuck is designed to dynamically change the interval between its grooves between two states: a narrow interval for stable clamping during posture turning, and a wide interval for easy substrate transfer. This dynamic adjustment allows the same device to fulfill both contradictory requirements at different operational stages
Solution Approach 2:
The locking groove is segmented into two distinct grooves: a guide groove with a V-shape for guiding the substrate peripheral edge, and a locking groove with a larger thickness for clamping the substrate end surface. This segmentation allows each groove to perform its specific function optimally while working together to resolve the contradiction between stable positioning and easy transfer
2Reliability
If the reversing chuck maintains a narrow interval between grooves for stable clamping, then the substrate can be securely held during posture turning, but the substrate cannot be easily received by the transport unit requiring a wide movement space
Solution Approach 1:
The reversing chuck dynamically adjusts its groove interval to match the operational requirements: narrow interval when engaged with the substrate for reliable posture turning, and wide interval when transferring the substrate to the transport unit, thereby resolving the contradiction between reliability and movement space
3Manufacturing precision
If the substrate is tightly clamped in the locking groove for stable posture control, then the posture turning precision is improved, but the distance for vertical movement of the substrate is insufficient for proper handoff
Solution Approach 1:
The system dynamically changes the clamping state of the reversing chuck between tight clamping for precision posture turning and loose holding for adequate vertical movement during transfer, resolving the contradiction between precision and movement distance
Solution Approach 2:
The divided groove structure with guide groove and locking groove allows the substrate to be guided into position and then clamped securely, yet still permits sufficient vertical movement when needed for transfer, addressing both precision and movement distance requirements
Data Source
AI summary
A substrate processing apparatus, the apparatus including: a batch type processing unit; a single wafer type processing unit; a posture turning unit; a first transport unit that transports the plurality of substrates processed by the batch type processing unit to the posture turning unit; and a second transport unit that transports the plurality of substrates brought into a horizontal posture by the posture turning unit to the single wafer type processing unit, in which the posture turning unit holds the plurality of substrates in a state where an interval above upper surfaces of the plurality of substrates is narrow when turning a posture of the plurality of substrates, and holds the plurality of substrates in a state where an interval above upper surfaces of the plurality of substrates is wide when transferring the plurality of substrates after the plurality of substrates are brought into a horizontal posture.