Waterproof Substrate Unit With Inclined Guide Grooves
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Solution Overview
Problem
Existing waterproof constructions for vehicle-mounted cases with electric equipment are costly due to the need for complex sealing measures, which do not effectively prevent water droplets from adhering to internal circuit boards.
Innovation Solution
A substrate unit design featuring a circuit board, connector portion, and case with an upper cover having guide grooves that incline from the board opposing region to an outer region, allowing water droplets to be discharged away from the circuit board, eliminating the need for separate waterproofing members and simplifying the construction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sealing measures are implemented to prevent water infiltration, then waterproofing performance is improved, but manufacturing cost increases
Solution Approach 1:
The ceiling portion of the upper cover is designed with an inclined surface that automatically guides water droplets away from the circuit board using gravity, eliminating the need for separate waterproofing members. The structure serves its own waterproofing function through its geometric design, reducing manufacturing cost while maintaining waterproofing performance.
Solution Approach 2:
The inclination angle of the ceiling portion is optimized to effectively guide water droplets. By changing the geometric parameter (inclination angle) of the ceiling surface, the patent achieves effective water drainage without requiring additional waterproofing components, thus reducing manufacturing cost while maintaining reliable waterproofing.
2Reliability
If sealing measures are implemented to prevent water infiltration, then waterproofing performance is improved, but device complexity increases
Solution Approach 1:
The upper cover's ceiling portion is designed to perform the waterproofing function itself through its inclined surface geometry. This self-service approach eliminates the need for separate waterproofing members such as gaskets or seals, thereby simplifying the overall construction while maintaining effective waterproofing performance.
Solution Approach 2:
The waterproofing function is merged into the upper cover structure itself. The ceiling portion of the upper cover simultaneously serves as both a structural component and a waterproofing element, guiding water droplets away from the circuit board. This integration reduces the number of separate components and simplifies the overall device construction.
3Object-affected harmful factors
If waterproofing members are added to prevent water adherence, then protection of circuit board is improved, but assembly efficiency decreases
Solution Approach 1:
The upper cover is designed to guide water droplets away from the circuit board through its inclined ceiling surface, performing the protection function itself without requiring separate waterproofing members. This reduces the number of assembly steps and improves assembly efficiency while effectively preventing water droplet adherence to the circuit board.
Solution Approach 2:
The protective waterproofing function is combined with the upper cover structure. The ceiling portion of the upper cover serves dual purposes: providing structural coverage and guiding water droplets away from the circuit board. This integration eliminates the need to assemble separate waterproofing members, thereby improving assembly efficiency while maintaining protection against water adherence.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces water droplet adherence to the circuit board by guiding infiltrated or condensed water droplets away from the board, enhancing waterproofing without additional parts, thus improving assembly efficiency and reducing manufacturing costs.
Implementation Method 1
A guide grooves inclined from the board opposing region to the outer region guides water droplets present on the board opposing region to the outer region to discharge the water droplets away from the circuit board
Data Source
AI summary
A substrate unit includes a circuit board; a connector portion mounted on the circuit board; and a case that contains the circuit board. The case includes a lower case having an accommodation section opened upward and accommodating the circuit board. An upper cover covers the accommodation section of the lower case. An aperture is opened in a side wall of the case, allowing the connector portion to be fitted to a counterpart connector portion. The upper cover includes a ceiling portion having a board opposing region that opposes the circuit board accommodated in the accommodation section and an outer region is located outside of the board opposing region without opposing the circuit board; and guide grooves inclined from the board opposing region to the outer region. The guide grooves discharging the water droplets away from the circuit board.