Substrate Processing Utility Layout for Compact Maintenance Access

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Solution Overview

Problem

Existing substrate processing apparatuses for semiconductor manufacturing require large footprints to secure maintenance areas, which can hinder efficient use of space.

Innovation Solution

The apparatus is designed with two adjacent processing modules, each with a processing container and utility systems including exhaust and supply boxes. These utility systems are arranged to face each other across a maintenance area, allowing for reduced footprint while maintaining access for maintenance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a vertical substrate processing apparatus is used to process multiple substrates at once, then processing efficiency is improved, but the footprint becomes large due to the need to secure a maintenance area

Engineering Contradiction:
Improveprocessing efficiencyVSAvoidfootprint
Core Design Contradiction:
ProductivityVSArea of stationary object

Solution Approach 1:

The patent repositions the maintenance area from the front side to the back side of the processing apparatus, utilizing the back surface space that was previously underutilized. This dimensional relocation allows the front side to be fully dedicated to substrate processing operations, thereby improving processing efficiency without increasing the overall footprint.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The apparatus is divided into functionally distinct zones: the front side is segmented for substrate processing operations while the back side is segmented for maintenance activities. This spatial segmentation allows both processing efficiency and maintenance access to be optimized simultaneously within the same footprint.

Inventive Principle:
Principle #1Segmentation

2Area of stationary object

If the footprint of the substrate processing apparatus is reduced, then space utilization is improved, but the maintenance area may become insufficient

Engineering Contradiction:
ImprovefootprintVSAvoidmaintenance access
Core Design Contradiction:
Area of stationary objectVSEase of repair

Solution Approach 1:

The maintenance area is relocated to the back side of the apparatus, utilizing the previously underutilized back surface space. This allows the front side to be compact while the back side provides adequate space for maintenance operations, effectively resolving the contradiction between reduced footprint and sufficient maintenance access.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

Instead of providing maintenance access from the conventional front side, the patent inverts the approach by providing maintenance access from the back side. This inversion allows the front side to be optimized for processing while the back side is optimized for maintenance, achieving both compact footprint and adequate maintenance area.

Inventive Principle:
Principle #13The other way round (Inversion)

Data Source

PatentUS20250201585A1Substrate processing apparatus and method of manufacturing semiconductor device
Publication Date: 2025.06.19 KOKUSAI DENKI KK
  • US20250201585A1 patent drawing
  • US20250201585A1 patent drawing
  • US20250201585A1 patent drawing

AI summary

A substrate processing apparatus includes a processing module including a process container for processing a substrate and a transfer chamber below the process container, a utility system adjacent backward from the process module along a side surface of the transfer chamber. The utility system includes at least one of a supply system to supply a process gas into the process container, or an exhaust system to exhaust an inside of the process container. At least a portion of the supply system is housed in a supply box and at least a portion of the exhaust system is housed in an exhaust box. the supply box is disposed adjacent to a side of the exhaust box, which is an opposite side to another side of the exhaust box that is disposed adjacent to the transfer chamber. A final valve of the supply system is disposed directly above the exhaust box.