Substrate Holding Plate With Vacuum Alignment for Centered Positioning
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Solution Overview
Problem
Existing substrate holding devices fail to accurately maintain substrates in the central region of a processing plate, leading to process failures during unit processes like heating or cooling in semiconductor manufacturing.
Innovation Solution
A substrate holding device with guide parts and an alignment mechanism using vacuum suction to precisely position the substrate in the central region, featuring inclined portions and sidewall structures, and return parts for repositioning guide parts after use.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a guide part is disposed adjacent to a peripheral region of the plate, then the substrate may be placed in the central region of the plate, but the guide part may not exactly place the substrate in the central region of the plate
Solution Approach 1:
The patent introduces an alignment part as an intermediary component between the guide part and the substrate. The alignment part includes an alignment protrusion that fits into an alignment groove on the substrate, providing precise positional reference. This mediator ensures the substrate is exactly positioned in the central region of the plate, resolving the inaccuracy of simple guide parts.
Solution Approach 2:
The patent replaces the purely mechanical guide part system with a vacuum-based holding system. The plate includes a vacuum hole that applies vacuum force to hold the substrate firmly in position. This substitution of mechanical holding with vacuum holding enhances both positioning accuracy and placement reliability.
2Reliability
If the substrate is not exactly disposed in the desired position on the plate, then process failures may occur during unit processes, but additional alignment mechanisms increase device complexity
Solution Approach 1:
The patent merges the guide part, alignment part, and vacuum holding functions into a single integrated substrate holding device. The guide part directs the substrate, the alignment part ensures precise positioning through protrusion-groove engagement, and the vacuum hole provides firm holding. This combination achieves high process reliability without requiring multiple separate complex systems.
Solution Approach 2:
The plate serves multiple functions: it acts as the processing surface, contains vacuum holes for holding the substrate, and works with guide parts and alignment parts for positioning. This multi-functionality reduces the need for additional dedicated components, thereby limiting the increase in device complexity while maintaining high reliability.
3Measurement precision
If guide parts are used to move the substrate, then the substrate can be positioned in the central region, but the guide parts need to be returned to initial position after use
Solution Approach 1:
The patent implements a return part with an elastic element that automatically returns the guide part to its initial position after substrate processing. The elastic element stores energy during substrate positioning and releases it to propel the guide part back, enabling self-service operation without manual intervention. This reduces the time loss associated with guide part repositioning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures the substrate is accurately positioned, preventing process failures and enhancing the reliability of integrated circuit devices by providing sufficient support and precise alignment.
Implementation Method 1
an alignment part configured to move the at least one guide part toward the central region of the plate utilizing a vacuum suction mechanism
Data Source
AI summary
An apparatus for processing a substrate may include a substrate holding part configured to maintain and support a substrate, a substrate transfer part configured to load the substrate onto the substrate holding part and to unload the substrate from the substrate holding part, and a substrate processing part configured to heat the substrate or to cool the substrate. The substrate holding part may include a plate configured to maintain and support the substrate, guide parts configured to move the substrate into a central region of the plate, and an alignment part configured to move the guide parts toward the central region of the plate utilizing a vacuum suction mechanism.