Substrate Vacuum Hole Cleaning for Stable Wafer Suction

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Solution Overview

Problem

Conventional substrate processing methods face issues with vacuum holes being partially or entirely blocked by extraneous matter and fumes, leading to inefficient vacuum pressure application and potential scattering of impurities.

Innovation Solution

An apparatus with a cleaning part that includes a cleaning solution supply and discharge system to remove extraneous matter from vacuum holes, utilizing valves and lines to control the flow of cleaning solution, along with a flow measurement and pumping system to ensure complete removal without scattering.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If air is sprayed into the vacuum holes to remove extraneous matter, then the vacuum holes can be cleaned, but the extraneous matter scatters to the outside of the vacuum holes

Engineering Contradiction:

Improvecleaning effectivenessVSAvoidscattering of extraneous matter

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

A cleaning solution is introduced as an intermediary medium to dissolve and remove extraneous matter from vacuum holes. The cleaning solution flows through the vacuum holes, dissolving the extraneous matter, and then drains away, preventing scattering of the removed material while effectively cleaning the holes.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention uses hydraulic principles by introducing a liquid cleaning solution through the vacuum holes. The cleaning solution is supplied under controlled pressure, flows through the holes to remove extraneous matter, and then drains away, utilizing fluid dynamics to achieve cleaning without scattering.

Inventive Principle:

Principle #29Pneumatics and hydraulics

2Reliability

If vacuum holes are used to apply vacuum pressure to the substrate, then the substrate can be held stably, but the vacuum holes become blocked by extraneous matter and fumes

Engineering Contradiction:

Improvevacuum pressure applicationVSAvoidvacuum hole blockage

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The cleaning solution is supplied to the vacuum holes before or during the substrate processing operation to prevent extraneous matter and fumes from accumulating and blocking the holes. This preliminary cleaning action maintains the vacuum holes clear, ensuring continuous reliable vacuum pressure application without interruption.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The cleaning solution supply operates continuously or periodically to maintain the vacuum holes clear throughout the substrate processing operation. This continuous cleaning action ensures that the vacuum holes remain unblocked, maintaining stable vacuum pressure application without interruption or degradation of performance.

Inventive Principle:

Principle #20Continuity of useful action

3Reliability

If the cleaning solution is discharged from the vacuum holes, then the extraneous matter is removed, but the cleaning solution may scatter the extraneous matter outside

Engineering Contradiction:

Improveextraneous matter removalVSAvoidscattering of extraneous matter

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The cleaning solution acts as an intermediary that dissolves extraneous matter and transports it away from the vacuum holes in a controlled manner. The solution carries the dissolved extraneous matter through the drainage path to a collection point, preventing scattering while achieving complete removal.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The cleaning solution drainage system utilizes hydraulic principles to control the flow of cleaning solution and dissolved extraneous matter. The solution is drained through controlled pathways that prevent scattering, using gravity and pressure differentials to direct the flow to an appropriate disposal or collection location.

Inventive Principle:

Principle #29Pneumatics and hydraulics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus effectively cleans vacuum holes, maintaining stable vacuum pressure application and preventing blockage, enhancing the reliability and stability of substrate processing.

Implementation Method 1

vacuum holes configured to apply a vacuum pressure to a rear face of a substrate

Methodology Applied

Scientific EffectVacuum pressure: Vacuum

Implementation Method 2

a cleaning solution supply part configured to provide a cleaning solution into the vacuum holes

Methodology Applied

Scientific EffectFluid flow through porous/holes structure:

Implementation Method 3

a cleaning solution discharge part configured to discharge the cleaning solution from the vacuum holes

Methodology Applied

Scientific EffectFluid drainage:

Data Source

PatentUS12539531B2Apparatus for processing a substrate

Publication Date: 2026.02.03 SYSTEM ENGINEERING MEGA SOLUTION CO LTD

AI summary

An apparatus for processing a substrate may include a vacuum suction part including vacuum holes configured to apply a vacuum pressure to a rear face of a substrate while a predetermined process is performed on the substrate, and a cleaning part configured to clean the vacuum holes in a cleaning process of cleaning the vacuum holes. The cleaning part may include a cleaning solution supply part configured to provide a cleaning solution into the vacuum holes, and a cleaning solution discharge part configured to discharge the cleaning solution from the vacuum holes.