Substrate Vent Apertures for Electronic Package Moisture Control
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Solution Overview
Problem
Existing IC packaging methods face challenges due to outgassing, where moisture and gases can cause corrosion and delamination issues, particularly in larger packages where trapped gases can exert significant pressure leading to module failure.
Innovation Solution
Incorporating a substrate with vent apertures to facilitate the exit of moisture and outgassed materials, providing a support structure for dielectric layers and electronic devices, which reduces the accumulation of these gases and minimizes delamination risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a window frame structure is used to control package flatness and stresses, then mechanical stability is improved, but moisture and gases become trapped causing corrosion and delamination
Solution Approach 1:
The patent introduces a porous or perforated layer within the package structure that allows moisture and gases to escape while maintaining mechanical support. This porous structure resolves the contradiction by providing both structural stability and moisture venting capability.
Solution Approach 2:
The patent introduces a venting layer or channel structure as an intermediary element between the rigid window frame and the dielectric layers. This intermediary provides a pathway for moisture escape while the window frame maintains overall package flatness and mechanical stability.
2Area of stationary object
If package size increases to forty to sixty millimeters square, then device capacity is improved, but moisture travel distance increases to fifteen to twenty millimeters causing greater de-lamination risk
Solution Approach 1:
The patent divides the large package into smaller regions by introducing venting channels or porous structures that segment the moisture escape paths. This creates multiple shorter escape routes throughout the package, reducing the maximum travel distance moisture must travel even in large forty to sixty millimeter packages.
Solution Approach 2:
The patent introduces vertical venting channels or three-dimensional porous structures that provide moisture escape paths in the depth dimension rather than relying solely on lateral diffusion. This dimensional approach reduces moisture travel distance across large package areas by providing direct vertical escape routes.
3Object-generated harmful factors
If vent apertures are added to the substrate, then moisture and gas escape is improved, but structural integrity may be compromised
Solution Approach 1:
The patent implements vent apertures with specific local characteristics - controlling their size, distribution, and positioning - to provide adequate moisture escape while maintaining overall substrate structural integrity. The apertures are strategically placed and sized to balance venting effectiveness with mechanical strength requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The vent apertures effectively reduce chip and package failure by allowing the escape of moisture and gases, thereby enhancing the reliability of electronic packages by preventing corrosion and delamination.
Implementation Method 1
moisture can turn gaseous, apply pressure within a build-up interconnect structure
Implementation Method 2
trapped moisture can turn gaseous, apply pressure within a build-up interconnect structure
Data Source
AI summary
An apparatus and method, the apparatus includes a substrate configured to support a plurality of dielectric layers, a device coupling area positioned in the substrate, and a plurality of gas exit apertures formed through the substrate. The plurality of gas exit apertures is configured to provide venting of at least one of moisture and outgassed material and the device coupling area is configured to receive an electronic device coupleable to the plurality of dielectric layers.