Substrate Via Array Layout for Universal Component Interconnects
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Solution Overview
Problem
The existing process of developing substrates with customized via arrangements for external electrical components is time-consuming and costly, as it requires specific configurations for different components.
Innovation Solution
An electronic device with a substrate featuring a higher distribution density of first vias, where some are electrically connected to second vias and others are floating, allowing for a versatile substrate that can accommodate most types of external electrical components without the need for custom manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If substrates are customized with specific via arrangements for different external electrical components, then the adaptability to different components is improved, but the manufacturing time and cost increase
Solution Approach 1:
The substrate is designed with a universal via arrangement where the density of first vias in the array is higher than the density of second vias, allowing a single substrate design to accommodate multiple different external electrical components through selective electrical connections, eliminating the need for custom substrate development for each component type
2Adaptability or versatility
If substrates are customized with specific via arrangements for different external electrical components, then the adaptability to different components is improved, but the manufacturing cost increases
Solution Approach 1:
The substrate employs a universal via array design with higher density first vias that can be selectively connected to different external electrical components, allowing a single manufacturing process to produce substrates suitable for multiple component types, thereby reducing per-unit manufacturing cost through economies of scale
3Adaptability or versatility
If a higher density of first vias is used in the substrate array, then the versatility for different components is improved, but the electrical complexity increases due to floating vias
Solution Approach 1:
The substrate implements local quality by having different via types with different functions: first vias with higher density provide versatile connection points, while second vias provide selective connections to external components. The floating first vias that are not connected to second vias serve local shielding functions to manage electrical complexity
Solution Approach 2:
The patent converts the potential harm of floating vias (which could create electrical interference) into a benefit by using them as shielding elements. The higher density array of first vias, even when floating, provides electromagnetic shielding that improves signal integrity for connected vias, thus transforming what could be a complexity issue into a performance enhancement
Data Source
AI summary
An electronic device having a substrate includes a substrate and at least one outer layer. The substrate has a plurality of first vias. The outer layer has a plurality of second vias. The outer layer is disposed on a side of the substrate. The first vias have a larger distribution density or quantity than the second vias so that a portion of the first vias are electrically connected to the second vias, and a portion of the first vias are electrically floating.