Substrate Via Heat Path for Compound Semiconductor Cooling
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Solution Overview
Problem
Electronic devices with functional element substrates made of materials like compound semiconductors face inadequate heat dissipation due to lower thermal conductivity, which hinders efficient transfer of heat generated from functional elements to the base substrate.
Innovation Solution
Incorporating a metal connection body and a via with higher thermal conductivity than the substrate, extending from the functional element substrate's first main surface to the base substrate, to create a heat conduction path that enhances heat dissipation by connecting the metal body outside the substrate to the base substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If compound semiconductor material is used for functional element substrate, then device functionality is achieved, but thermal conductivity is insufficient leading to poor heat dissipation
Solution Approach 1:
A metal layer is introduced as an intermediary heat conduction path between the functional element substrate and the base substrate. The metal layer has higher thermal conductivity than the compound semiconductor substrate, serving as a mediator to efficiently transfer heat from the substrate to the base substrate, thereby resolving the heat dissipation problem caused by the low thermal conductivity of compound semiconductors.
Solution Approach 2:
The patent creates a composite heat conduction system combining the compound semiconductor functional element substrate with a metal layer and base substrate. This composite structure leverages the high thermal conductivity of metal materials to compensate for the low thermal conductivity of the compound semiconductor, achieving effective heat dissipation while maintaining the functional properties of the original substrate.
2Reliability
If heat conduction path is extended through metal body and via, then heat dissipation is improved, but device structure becomes more complex
Solution Approach 1:
The metal layer serves multiple functions: it acts as an electrode for electrical connection and simultaneously functions as a heat conduction path for thermal management. The via structure also provides both electrical connectivity and thermal conduction. This multi-functionality reduces the need for separate dedicated heat dissipation components, thereby limiting the increase in structural complexity while achieving improved heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation from the functional element substrate's first main surface to the base substrate, effectively addressing the thermal conductivity limitations of compound semiconductor materials and enhancing overall heat transfer efficiency.
Implementation Method 1
a via that connects the portion of the first metal body outside the functional element substrate and the base substrate to each other, the via having a higher thermal conductivity than the functional element substrate
Data Source
AI summary
An electronic device includes a substrate, a base substrate, a metal connection body, a metal body, and a via. The substrate includes a first main surface provided with functional elements and is a piezoelectric substrate or a compound semiconductor substrate. The substrate is mounted on the base substrate such that a second main surface of the substrate opposite to the one main surface faces the base substrate. The metal body is provided at the first main surface of the substrate and includes at least a portion that extends to outside the substrate in plan view from the one main surface. The via connects the portion of the metal body outside the substrate and the base substrate to each other and has a higher thermal conductivity than the substrate.