Substrate Via Interconnect for Narrow Display Frames
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Solution Overview
Problem
Existing display devices face challenges in achieving a narrower frame structure and reducing costs due to the need for additional wiring substrates and complex connections between substrates.
Innovation Solution
An electronic apparatus comprising a first substrate with a conductive layer, a second substrate with a conductive layer separated from the first, and a connecting material that electrically connects them through a hole, eliminating the need for additional wiring substrates by forming a contact hole using a laser beam and ensuring reliable conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional wiring substrates are used to connect conductive layers between substrates, then electrical connectivity is achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the wiring function directly into the substrate structure by forming conductive layers on the substrate surfaces and creating through-substrate holes with connecting materials. This eliminates the need for separate wiring substrates, reducing device complexity while maintaining electrical connectivity between opposing substrates.
Solution Approach 2:
The patent extracts the wiring function from separate wiring substrates and integrates it directly into the substrate structure. By forming conductive layers and connecting holes within the substrates themselves, the design removes unnecessary intermediate components, simplifying the overall device architecture.
2Reliability
If additional wiring substrates and complex connections are used, then electrical connectivity is ensured, but manufacturing cost increases
Solution Approach 1:
The patent combines multiple functions (substrate support, wiring, and connection) into a single integrated structure. By forming conductive layers and connecting materials directly on and within the substrates, it eliminates the need for separate wiring substrates, reducing the number of manufacturing steps and material costs while ensuring reliable electrical connectivity.
Solution Approach 2:
The patent uses cost-effective materials and processes for forming conductive layers and connecting materials directly on the substrates, replacing expensive wiring substrates with simpler, more economical structures that achieve the same electrical connectivity function.
3Length of moving object
If frame width is reduced for narrower display device, then device size is reduced, but structural integrity and connection reliability may be compromised
Solution Approach 1:
The patent moves the connection structure into the vertical dimension by forming through-substrate holes that penetrate the substrate thickness. This allows electrical connections to be made vertically through the substrates rather than requiring extended horizontal wiring, enabling narrower frame widths while maintaining connection reliability through direct vertical pathways.
Solution Approach 2:
The patent segments the connection path into distinct functional zones: conductive layers on substrate surfaces, through-substrate holes, and connecting materials filling the holes. This segmentation allows each component to be optimized for its specific function, ensuring reliable electrical connectivity even in compact narrow-frame designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a narrower frame structure and cost reduction by eliminating unnecessary components and simplifying the connection process, while maintaining reliable electrical connectivity between substrates.
Implementation Method 1
forming a contact hole using a laser beam
Data Source
AI summary
An electronic apparatus is provided and includes a first substrate comprising a first conductive layer; a second substrate which is opposed to the first conductive layer and is separated from the first conductive layer, the second substrate including a second conductive layer, and a first hole penetrating the second substrate; and a connecting material which electrically connects the first conductive layer and the second conductive layer via the first hole, wherein the connecting material consists of a single material; and the second conductive layer is located on the second substrate on a side opposite to a side that is opposed to the first conductive layer.