Substrate Via Sequencing to Minimize Surface Disruption
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Solution Overview
Problem
The manufacturing of electronic devices faces challenges in forming vias through substrates, particularly in transparent substrates, due to issues like substrate surface disruption, metal contamination, and thermal expansion differences, which affect the formation of thin-film-transistors and other electronic elements.
Innovation Solution
The method involves forming partial vias in the substrate before electronic device formation, using techniques like laser damage and etching, and then completing the vias after device formation, with the use of etch protection materials and selective etching to minimize substrate disruption and optimize processing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vias are formed through the substrate before electronic device formation, then electrical connectivity is established, but substrate surface disruption occurs making it difficult to form electronic devices
Solution Approach 1:
The via formation process is divided into two separate stages: first forming vias through the substrate, then forming electronic devices on the substrate surface. This segmentation allows each process to be optimized independently, with the first stage ensuring electrical connectivity and the second stage ensuring surface quality for device formation.
Solution Approach 2:
The vias are formed in advance before the electronic devices are created on the substrate surface. This preliminary action establishes the electrical connectivity infrastructure early in the manufacturing process, allowing subsequent device formation to proceed without interference from via formation activities.
2Reliability
If metal is deposited in the vias, then electrical connectivity is achieved, but it interferes with later formation of thin-film-transistors and conductor lines
Solution Approach 1:
The manufacturing process is segmented into distinct phases: via formation and metalization occur first, followed by thin-film-transistor and conductor line formation. This temporal segmentation prevents metal contamination of sensitive electronic elements while ensuring electrical connectivity is established early.
Solution Approach 2:
Metal deposition in the vias is performed as a preliminary action before forming thin-film-transistors and conductor lines. This sequencing ensures that the metalized vias serve as underlying interconnect structures without interfering with the formation of surface electronic elements.
3Reliability
If complete vias are formed through the substrate, then electrical connectivity is established, but processing time increases
Solution Approach 1:
The vias are formed completely through the substrate in advance as a preliminary action, establishing electrical connectivity early in the manufacturing process. This allows subsequent electronic device formation to proceed independently without requiring additional via formation time.
Solution Approach 2:
The via formation process maintains continuous useful action by completing the entire via formation and metalization sequence before transitioning to electronic device formation. This continuous approach eliminates interruptions and optimizes overall processing time by ensuring each process runs to completion before the next begins.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces substrate surface disruption and processing time, allowing for the formation of electronic devices with minimal impact on existing components and enabling the creation of high-resolution microLED displays and other electronic devices with improved efficiency.
Implementation Method 1
forming partial vias in the substrate before electronic device formation, using techniques like laser damage and etching
Data Source
AI summary
Embodiments are related to systems and methods for forming vias in a substrate, and more particularly to systems and methods for reducing substrate surface disruption during via formation.