Substrate Processing Method Using Volatile Protective Film
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Solution Overview
Problem
Conventional substrate processing methods, such as dry etching, require time management to prevent oxidation of exposed metal wiring, leading to decreased productivity due to the need for time limits (Q-time) and increased complexity in process management.
Innovation Solution
A substrate processing method involving the application of a volatile processing liquid that forms a protective film on the substrate, allowing for extended exposure without oxidation, and a subsequent removal process using an alkali developer to peel off the film and reaction products without chemical action.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a dry etching process is performed to expose metal wiring, then the metal wiring can be accessed for subsequent processing, but the exposed metal wiring is susceptible to oxidation and requires strict time management (Q-time)
Solution Approach 1:
A protective film is formed on the substrate surface before the metal wiring exposure in the dry etching process. This preliminary protective layer prevents oxidation of the exposed metal wiring during subsequent handling and processing steps, eliminating the need for strict Q-time management while maintaining manufacturing precision
Solution Approach 2:
A protective film serves as an intermediary layer between the exposed metal wiring and the oxidizing environment. This film acts as a barrier that prevents direct contact between oxygen and the metal surface, allowing extended exposure time without oxidation damage
2Reliability
If strict time management (Q-time) is implemented to prevent oxidation, then metal wiring quality is maintained, but productivity decreases due to increased process complexity
Solution Approach 1:
By forming a protective film before etching and removing it after processing, the system eliminates the need for continuous time management during critical steps. This preliminary and terminal protective action simplifies process control while maintaining reliability
Solution Approach 2:
The protective film acts as a time-independent intermediary that provides oxidation protection regardless of exposure duration. This decouples reliability from time management constraints, allowing more flexible and efficient production scheduling
3Productivity
If the substrate is exposed for extended periods, then more processing steps can be performed, but oxidation of metal wiring occurs
Solution Approach 1:
The protective film is applied before the sequence of processing steps, enabling extended exposure to multiple processes without oxidation risk. This preliminary protection layer allows the substrate to remain in the processing line longer with improved productivity
Solution Approach 2:
The protective film serves as a mediator that shields the metal wiring from oxidation during extended processing sequences. This intermediary layer enables multiple processing steps to be performed without the harmful effects of oxidation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach eliminates the need for Q-time management, enhances productivity by preventing oxidation and reaction product growth, and efficiently removes reaction products without damaging the substrate.
Implementation Method 1
a processing liquid, which contains a volatile component and forms a film on a substrate, onto the substrate
Implementation Method 2
a subsequent removal process using an alkali developer to peel off the film and reaction products without chemical action
Data Source
AI summary
Productivity can be improved. A substrate processing method includes a processing liquid supplying process of supplying a processing liquid, which contains a volatile component and forms a film on a substrate, onto the substrate on which a pre-treatment, which requires atmosphere management or time management after the pre-treatment, is performed; and an accommodating process of accommodating, in a transfer container, the substrate on which the processing liquid is solidified or cured by volatilization of the volatile component.