Substrate Processing Method for Interrupted Wafer Reprocessing

Solution Overview

Problem

In semiconductor manufacturing, processing interruptions due to commands from Fault Detection & Classification systems result in wasted time and resources, as wafers are often skipped or discarded, especially when interrupted during specific polishing or cleaning steps, due to the need for manual recipe changes and long waiting times for reprocessing.

Innovation Solution

A substrate processing method that allows for customized reprocessing of interrupted wafers by setting them in a standby state, suspending reporting to the online system, and automatically selecting reprocessing recipes based on the interrupted process step, prioritizing reprocessing over unprocessed substrates to minimize waiting time and increase yield.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a processing interruption command is issued during substrate processing, then the reliability of the manufacturing process is improved by preventing defective substrates from proceeding, but the productivity decreases due to loss of time and potential discarding of substrates

Engineering Contradiction:

Improveprocess reliabilityVSAvoidmanufacturing productivity

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The system performs preliminary actions by automatically preparing reprocessing recipes and setting substrates in standby state before manual intervention is needed. The host computer automatically creates customized reprocessing recipes based on the interruption reason and process step, and the substrate is kept in standby state with the recipe pre-configured, eliminating the need to carry the wafer carrier out and re-register recipes manually.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The system enables self-service by allowing the apparatus to automatically handle reprocessing without manual intervention. The host computer automatically selects appropriate reprocessing recipes based on interruption reasons, and the apparatus can autonomously resume processing after interruption by loading the pre-prepared recipe, making the system serve itself rather than requiring operator intervention.

Inventive Principle:

Principle #25Self-service

2Adaptability or versatility

If manual recipe changes are required for reprocessing interrupted substrates, then the adaptability to different interruption cases is improved, but the ease of operation deteriorates due to the need to carry wafer carrier out and re-register recipes

Engineering Contradiction:

Improvereprocessing adaptabilityVSAvoidreprocessing operation ease

Core Design Contradiction:

Adaptability or versatilityVSEase of operation

Solution Approach 1:

The system enables self-service by allowing the apparatus to automatically handle reprocessing without manual intervention. The host computer automatically selects appropriate reprocessing recipes based on interruption reasons, and the apparatus can autonomously resume processing after interruption by loading the pre-prepared recipe, making the system serve itself rather than requiring operator intervention.

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The system performs preliminary actions by automatically preparing reprocessing recipes and setting substrates in standby state before manual intervention is needed. The host computer automatically creates customized reprocessing recipes based on the interruption reason and process step, and the substrate is kept in standby state with the recipe pre-configured, eliminating the need to carry the wafer carrier out and re-register recipes manually.

Inventive Principle:

Principle #10Preliminary action

3Reliability

If wafers are discarded after processing interruption, then the reliability is improved by avoiding defective products, but the loss of substance increases due to wasted wafers and processing resources

Engineering Contradiction:

Improveproduct quality reliabilityVSAvoidwafer loss

Core Design Contradiction:

ReliabilityVSLoss of substance

Solution Approach 1:

The system implements discarding and recovering by initially discarding the interrupted substrate from normal processing flow but then recovering it through automatic reprocessing. The substrate is set in standby state rather than being permanently discarded, and the system automatically prepares and executes reprocessing recipes to recover the substrate and convert it back into a usable product, thereby reducing wafer loss while maintaining quality standards.

Inventive Principle:

Principle #34Discarding and recovering

Data Source

PatentUS9847263B2Substrate processing method including reprocessing rejected wafers

Publication Date: 2017.12.19 EBARA CORP

AI summary

A substrate processing method which can increase the yield by reprocessing a substrate whose processing has been interrupted by a processing interruption command during a substrate processing is disclosed. A substrate processing method performs a predetermined processing of a substrate while sequentially transporting the substrate to a plurality of processing sections according to a preset recipe. The substrate processing method includes processing a substrate in one of the processing sections; interrupting the processing of the substrate by a processing interruption command during processing of the substrate; setting the substrate whose processing has been interrupted in a standby state; and customizing the recipe and performing reprocessing of the processing-interrupted substrate according to the customized recipe, or performing reprocessing of the processing-interrupted substrate according to a preset recipe for reprocessing.