Electronic Component Substrate Warpage Reduction via Edge Connection
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Solution Overview
Problem
Electronic components with substrates having different thermal expansion coefficients face warpage issues during manufacturing and usage, leading to reduced joining strength and reliability due to thermal stress, as existing methods fail to effectively address the bimetal effect and repeated thermal expansion.
Innovation Solution
An electronic component design featuring a first substrate and a second substrate connected via a connecting member that fixes the peripheral edge portion of the second substrate to the first substrate, allowing for deformation and reducing thermal stress, while maintaining electrical connectivity through conductive or non-conductive adhesive agents.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the component substrate is directly connected to the wiring substrate, then the manufacturing process is simple, but warpage occurs due to thermal expansion coefficient differences
Solution Approach 1:
The patent introduces an intermediate substrate that segments the direct connection between the component substrate and wiring substrate. This intermediate layer divides the thermal expansion stress path, preventing direct warpage transmission while maintaining manufacturing feasibility through a structured multi-layer assembly process.
2Adaptability or versatility
If substrates with different thermal expansion coefficients are joined, then functional integration is achieved, but joining strength decreases due to thermal stress
Solution Approach 1:
The patent employs a resin layer with specifically controlled thermal expansion characteristics that differ from both the component substrate and wiring substrate. This parameter adjustment in the intermediate material creates a gradient that absorbs thermal stress, preserving joining strength while enabling functional integration of different substrate types.
3Stability of the object's composition
If the component substrate is rigidly fixed, then structural stability is improved, but reliability decreases due to repeated thermal stress
Solution Approach 1:
The patent creates a semi-rigid connection system where the resin layer provides controlled flexibility. This dynamic structure allows the assembly to accommodate thermal expansion and contraction cycles without compromising structural integrity, thereby maintaining both stability and reliability under repeated thermal stress conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances manufacturing ease and reliability by absorbing thermal expansion, reducing stress on connecting members and preventing breakage, thus minimizing warpage and maintaining stable electrical connections despite thermal variations.
Implementation Method 1
The component substrate and the element component have different thermal expansion coefficients due to differences in respective materials thereof. For this reason, when mutually joined in a state of having received a thermal load, due to the bimetal effect arising from a difference in shrinkage rates after the completion of the joining process, warpage occurs in the component substrate.
Data Source
AI summary
An electronic component includes: a first substrate that comprises a first substrate surface; a second substrate that is arranged on the first substrate; and a connecting member that connects the first substrate and a peripheral edge portion of the second substrate. The second substrate is fixed to the first substrate by the connecting member.