Substrate Warpage Monitoring Using Embedded Inertial Sensors
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Solution Overview
Problem
Monitoring warpage deformation of substrates during treatment processes is challenging due to the sealed nature of treatment spaces, making it difficult to detect and determine the cause of warping, which can lead to defective substrates, especially for larger substrates.
Innovation Solution
A substrate warpage monitoring apparatus with a sensing unit and processor that detects warpage information using acceleration or gyro sensors, and transmits this information wirelessly, allowing for real-time monitoring and generation of warpage state information, even in confined treatment spaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a machine vision camera is used to monitor warpage deformation, then monitoring capability is improved, but the treatment space becomes too crowded and cannot accommodate the camera
Solution Approach 1:
The monitoring system is segmented into distributed sensing modules placed at multiple positions (center, intermediate, and edge regions) on the substrate itself, rather than using a single external vision camera. This segmentation allows monitoring functionality to be distributed across the substrate surface without requiring external space.
Solution Approach 2:
The sensing unit is nested directly on the substrate surface, with sensing modules integrated into the substrate structure. This nesting approach allows the monitoring system to occupy minimal additional space while maintaining full monitoring capability throughout the treatment process.
2Reliability
If the treatment space is sealed to maintain processing conditions, then treatment quality is improved, but access for monitoring equipment is lost
Solution Approach 1:
The substrate serves dual purposes: it is both the object being treated and the platform carrying the sensing unit. The sensing modules are integrated directly on the substrate, allowing the substrate to monitor its own warpage deformation without requiring external monitoring equipment that would need access to the sealed treatment space.
Solution Approach 2:
The sensing unit is mounted on the substrate before the substrate enters the treatment space. This preliminary mounting ensures that monitoring capability is already in place when the sealed treatment process begins, eliminating the need for post-treatment analysis or external monitoring during processing.
3Measurement precision
If multiple sensing modules are distributed across the substrate to improve monitoring accuracy, then measurement precision is improved, but device complexity increases
Solution Approach 1:
Each sensing module is designed as a universal, multi-functional unit that can detect warpage at its specific location and communicate with the external system. The modules use standard components (acceleration sensors, gyro sensors, or composite sensors) that perform multiple sensing functions, reducing overall system complexity despite the distributed architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate monitoring and management of warpage deformation during treatment processes, allowing for adjustments to minimize warping and improve substrate quality.
Implementation Method 1
Each of the plurality of sensing modules includes an acceleration sensor or a gyro sensor
Implementation Method 2
Each of the plurality of sensing modules includes an acceleration sensor or a gyro sensor
Data Source
AI summary
Disclosed is an apparatus for precisely monitoring warpage deformation of a substrate. The apparatus includes a sensing unit and a processor. The sensing unit is removably mounted on the substrate and detects information on the warpage deformation of the substrate during a treatment process performed on the substrate. The processor generates warpage state information on the basis of the warpage information detected by the sensing unit.