Substrate Warpage Measurement via Multi-Point Signal Projection
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Solution Overview
Problem
Warped substrates due to inhomogeneous heating and cooling during thermal processes lead to non-uniform expansion and contraction, causing processing delays and inefficiencies in substrate processing.
Innovation Solution
A substrate measurement system and method that projects a signal with a vertical component across the substrate's surface from multiple locations, capturing and analyzing the signals to determine the surface profile, allowing for detection and measurement of warpage using a sensor pair and track assembly with positional information.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional thermal processes utilize directional heat transfer via radiative, convective or conductive thermal processes, then heating and cooling can be performed, but non-uniform expansion and contraction rates occur causing substrate warpage
Solution Approach 1:
The thermal processing is divided into multiple heating zones with independent temperature control along the substrate travel path. Each zone can be optimized to compensate for heat loss and maintain uniform temperature distribution, preventing thermal warpage while enabling effective thermal processing.
2Manufacturing precision
If substrates are processed near the thermoplastic regime to achieve desired properties, then material characteristics can be optimized, but substrate warpage beyond acceptable levels occurs
Solution Approach 1:
Different regions of the substrate are subjected to locally optimized thermal conditions. The heating zones are configured to provide tailored temperature profiles to different areas, enabling the substrate to be processed near the thermoplastic regime for optimal material properties while maintaining acceptable flatness through localized thermal control.
3Productivity
If warpage is detected and measured before, during or after processing, then production throughput and yield can be improved, but additional measurement time and complexity are introduced
Solution Approach 1:
The measurement system is integrated with the thermal processing system, combining heating and measurement functions in a single apparatus. This allows warpage detection to occur during the thermal processing operation itself, eliminating separate measurement steps and reducing overall system complexity while maintaining high productivity.
Solution Approach 2:
The measurement system operates continuously during substrate transport through the thermal processing zones, rather than requiring separate before/during/after measurement steps. This continuous measurement approach maintains production throughput while providing real-time warpage data for process optimization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate detection and measurement of substrate warpage, improving production throughput and yield by identifying and addressing warpage issues before, during, or after processing.
Implementation Method 1
projecting a signal having a vertical component/profile across the surface of the substrate
Implementation Method 2
a first track assembly for moving the first sensor pair across at least a portion of the surface of the substrate
Implementation Method 3
a first encoder for determining positional information associated with the first track assembly
Data Source
AI summary
Systems, apparatuses and methods for determining a surface profile of a substrate are provided. In one embodiment, a method includes projecting a signal having a vertical component/profile across the surface of the substrate from a plurality of locations along a first side of the substrate, capturing the projected signals at each of a plurality of respective locations across the surface of the substrate and determining a surface profile for the substrate using the captured signals. The process can be automated using a controller having predetermined projection and capture positions along respective sides of the substrate, where a surface profile of the substrate can be automatically determined by the controller using the captured signals.