Substrate Warping Compensation via Relay Device Roughening
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Solution Overview
Problem
Existing substrate processing systems face challenges in accurately measuring and addressing warping of substrates during exposure treatment, leading to decreased throughput and exposure accuracy due to the inability to effectively account for substrate warping before transferring the substrate to the exposure device.
Innovation Solution
A substrate processing system that includes a film-forming device, a relay device, a warping data acquisition device, and a control device to form a photosensitive film, measure warping data, and transmit this data to the exposure device, with an optional roughening process for the substrate's back surface based on measured warping data to enhance handling and accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If warping measurement and processing is performed on substrates before exposure, then exposure accuracy is improved, but throughput decreases due to additional processing time
Solution Approach 1:
The system performs warping measurement and back surface roughening processing on substrates before they are transferred to the exposure device. By completing these preparatory actions in advance, the exposure device can directly use the measured warping data to compensate for substrate warping during exposure, thereby improving exposure accuracy without requiring additional time during the exposure process itself
Solution Approach 2:
The patent introduces a relay device as an intermediary between the film-forming device and the exposure device. This relay device includes a warping measurement unit that measures substrate warping and a roughening processing unit that applies roughening to the back surface. The relay device acts as a mediator that prepares substrates for exposure without disrupting the main exposure workflow, thus improving accuracy while maintaining throughput
2Manufacturing precision
If warping measurement is performed after film formation but before transfer, then exposure treatment accuracy is improved, but the process complexity increases
Solution Approach 1:
The patent combines the warping measurement function and the roughening processing function into a single relay device that operates between the film-forming device and the exposure device. By merging these functions into one integrated unit, the system improves exposure treatment accuracy through warping compensation while avoiding the complexity of separate independent measurement and processing systems
Solution Approach 2:
The relay device is designed with multi-functionality, serving both as a transfer mechanism between devices and as a warping measurement and roughening processing station. This universal device performs multiple functions (transfer, measurement, and processing) in one location, reducing overall system complexity while achieving improved exposure accuracy
Data Source
AI summary
A substrate processing apparatus includes a film-forming device that forms a photosensitive film on a front surface of a substrate, a warping data acquisition device that acquires measured warping data of the substrate, a roughening process device that applies roughening process on a back surface of the substrate, and a control device including circuitry that controls the warping data acquisition device such that after the photosensitive film is formed on the front surface of the substrate, the warping data acquisition device acquires the measured warping data before the photosensitive film on the substrate undergoes exposure process, and control the roughening process device such that before the photosensitive film on the substrate undergoes the exposure process, the roughening process device applies the roughening process on the back surface of the substrate based on the measured warping data.