Substrate Washing Nozzle Layout for Uniform Radial Particle Removal
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Solution Overview
Problem
Conventional washing devices for semiconductor wafers face challenges in achieving uniform washing coverage, particularly in removing fine particles of 65 nm or less, leading to incomplete cleaning and potential damage to fragile surfaces like copper wiring, due to inefficient liquid flow patterns and stagnation issues.
Innovation Solution
The washing device employs a combination of single tube nozzles and spray nozzles to direct washing liquids in a way that ensures flow over the entire substrate radius, with specific configurations such as landing positions and angles to enhance inertial and centrifugal forces, preventing stagnation and improving rinsing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional washing methods (single tube nozzle, spray nozzle, porous tube nozzle) are used to supply washing liquid to the substrate surface, then the washing process can be performed, but the washing liquid flow becomes non-uniform and stagnates in certain areas, resulting in insufficient removal of fine particles
Solution Approach 1:
The washing device divides the substrate surface into multiple radial zones and uses multiple nozzles positioned at different radial locations to supply washing liquid to each zone. This segmentation ensures uniform flow distribution across the entire substrate surface, preventing stagnation and improving particle removal efficiency in all areas.
Solution Approach 2:
The patent applies different nozzle types (single tube nozzles, spray nozzles, porous tube nozzles) to different radial zones of the substrate based on local washing requirements. Each nozzle type provides optimized flow characteristics for its specific zone, achieving uniform washing across the entire substrate surface.
2Productivity
If washing liquid is supplied using conventional nozzles, then the washing process can be completed, but the flow pattern causes liquid to stagnate in certain areas and insufficiently cover the entire substrate radius
Solution Approach 1:
The washing device incorporates substrate rotation to dynamically change the relative position between the nozzles and substrate surface during washing. Combined with multiple nozzles positioned at different radial locations, this dynamic approach ensures comprehensive and uniform washing liquid coverage across the entire substrate radius.
Solution Approach 2:
The patent transitions from single-point or single-line washing liquid supply to multi-point radial distribution by positioning nozzles at different radial distances from the substrate center. This dimensional expansion of the supply pattern achieves uniform coverage across the entire substrate surface.
3Reliability
If conventional washing methods are used, then the washing process can be performed, but fine particles of 65 nm or less cannot be effectively removed due to insufficient washing action
Solution Approach 1:
The washing device segments the substrate surface into multiple radial zones and assigns different nozzle types to different zones. This segmentation enables targeted washing action that effectively removes fine particles from all areas while maintaining a manageable nozzle configuration.
Solution Approach 2:
The patent employs multiple nozzle types (single tube, spray, porous tube) that can be selectively positioned at different radial locations to address various washing requirements across the substrate. This multi-functional approach achieves effective fine particle removal throughout the entire substrate surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures thorough cleaning across the substrate radius, reducing particle residue and minimizing surface damage, thereby enhancing washing quality and reliability.
Implementation Method 1
The washing liquid supplied to the surface of the substrate receives the centrifugal force due to rotation of the substrate to flow toward the outer circumference of the substrate.
Implementation Method 2
the flow of the washing liquid after landing on the substrate is affected not only by the centrifugal force, but by the inertia of the flow when there is a flow in the washing liquid in a direction parallel to the surface of the substrate prior to landing on the surface of the substrate
Implementation Method 3
when the surface of the substrate is inclined, the flow of the washing liquid is affected by gravity
Data Source
AI summary
A substrate washing device includes a roll washing member, a single tube nozzle and spray nozzle. The roll washing member linearly extends over the entire length of the diameter of the substrate and comes into slide-contact with the surface of the substrate. The single tube nozzle discharges washing liquid onto a roll winding side of the roll washing member so that the first washing liquid lands in the front center of the substrate. The spray nozzle sprays a second washing liquid in a fan shape toward a second area when the roll winding side area is divided into two areas.