Substrate Washing Section for Dipping Exposure Water Mark Prevention
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Solution Overview
Problem
The existing methods for forming resist patterns on substrates, such as semiconductor wafers, face issues with water drops remaining after dipping exposure, leading to non-uniform pattern resolution and increased costs due to the need for multiple heating sections to control the time from exposure to heating, which complicates wafer handling and throughput.
Innovation Solution
A coating and developing apparatus with integrated washing, waiting, and periphery exposing sections, controlled by a substrate carrying system that ensures timely washing and exposure to prevent water marks and adjust the time from exposure to heating, using a chemical liquid to form a water-repellent protective film and optimizing the substrate's path through the apparatus.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple heating sections are provided to control the time from exposure to heating, then the pattern resolution is maintained, but the device complexity and operational complexity increase
Solution Approach 1:
The washing section is positioned to wash the substrate immediately after exposure, before water drops can grow and cause marks. This preliminary washing action prevents the need for multiple heating sections to control timing, as the water mark prevention is achieved through timely washing rather than extended heating control
Solution Approach 2:
The washing function is extracted as a separate, dedicated section in the substrate processing path. By providing this specialized washing section at the optimal position, the system eliminates the need for complex multi-section heating arrangements to achieve the same pattern resolution goal
2Manufacturing precision
If multiple heating sections are provided to control the time from exposure to heating, then the pattern resolution is maintained, but the throughput decreases
Solution Approach 1:
The washing operation is performed immediately after exposure in a dedicated washing section, preventing water marks before they occur. This eliminates the need for extended processing through multiple heating sections, thereby maintaining high throughput while achieving pattern resolution
Solution Approach 2:
The substrate processing continues continuously through the washing section without interruption or extended timing control requirements. The washing action occurs naturally at the optimal point in the process flow, maintaining continuous substrate movement and high throughput
3Manufacturing precision
If washing is delayed until water drops become smaller, then water marks form on the resist film, but early washing increases device complexity
Solution Approach 1:
The washing section is positioned to perform washing immediately after exposure, before water drops have time to grow and cause marks. This preliminary action at the optimal timing point prevents water marks without requiring complex timing control, as the washing occurs naturally at the correct moment in the process flow
Solution Approach 2:
A dedicated washing section is introduced as an intermediary component between exposure and heating sections. This intermediary washing section handles the water mark prevention function, eliminating the need for complex timing control mechanisms that would otherwise be required to coordinate washing with substrate transport
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents water marks, maintains pattern resolution, and reduces the number of heating sections required, improving throughput and reducing operational complexity by ensuring timely washing and exposure processes.
Implementation Method 1
a washing section adapted to wash the surface of each substrate after it has been subjected to the dipping exposure process
Implementation Method 2
using a chemical liquid to form a water-repellent protective film
Implementation Method 3
a heating section adapted to heat the substrate after it has been subjected to a dipping exposure process
Implementation Method 4
a developing section adapted to perform a developing process, the substrate having been subjected to a dipping exposure process in an exposing apparatus
Data Source
AI summary
A coating and developing apparatus comprises a washing section for washing the surface of a substrate after it has been subjected to a dipping exposure process in an exposing apparatus, and a first substrate carrying means adapted to transfer the substrate carried out from the exposing apparatus after the dipping exposure process to the washing section. The first substrate carrying means is controlled by a control means. Namely, the control means controls the first substrate carrying means such that the substrate can be washed in the washing section in a period of time prior to a time zone in which the size of liquid drops remaining on the substrate due to the dipping exposure process becomes smaller quite rapidly, based on a carrying-out ready signal for the substrate from the exposing apparatus, by using a relationship between the time elapsed from the end of the dipping exposure process and the size of liquid drops remaining on the substrate due to the dipping exposure process.