Substrate Wells and Vias for Diode Orientation in Fluidic Assembly
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Solution Overview
Problem
The manufacturing of LED displays and devices faces challenges with low throughput and yield due to the difficulty in accurately depositing and orienting diodes on substrates, often resulting in defects and the need for redundant diodes to compensate, which increases costs and reduces efficiency.
Innovation Solution
The development of a fluidic assembly system with a substrate featuring wells and through hole vias designed to preferentially orient post-enhanced diodes in a non-inverted position, utilizing carrier liquids and substrate geometry to stabilize diodes in place, preventing dislocation and flipping, and optimizing well shapes and sizes to enhance capture efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional diodes per pixel are added to provide redundancy, then yield is improved, but device complexity and cost increase
Solution Approach 1:
The substrate features (wells with specific geometries, through-hole vias, and alignment markers) are prepared in advance to guide and stabilize diode placement. This preliminary structuring of the substrate enables correct diode orientation and position during the assembly process, reducing the need for post-assembly corrections and redundant diodes.
Solution Approach 2:
The diodes utilize the substrate features themselves for alignment and orientation guidance. The through-hole vias and well geometries provide self-aligning mechanisms that enable the diodes to self-correct their position and orientation during placement, improving yield without requiring additional external alignment systems or redundant components.
2Ease of manufacture
If traditional deposition methods are used, then manufacturing process is simple, but manufacturing precision deteriorates
Solution Approach 1:
The substrate features act as intermediary structures between the deposition system and the diodes. The wells, through-hole vias, and alignment markers serve as mediating elements that translate the general deposition process into precise diode placement and orientation, enabling accurate positioning without requiring complex deposition equipment or procedures.
3Productivity
If high flow rates are used in fluidic assembly, then assembly speed increases, but diode dislocation and flipping increase
Solution Approach 1:
The substrate features (wells with specific geometries and through-hole vias) are prepared in advance to provide stabilization during the fluidic assembly process. These pre-structured features create physical constraints that prevent diode flipping and dislocation even when carrier liquid flows at higher rates, enabling increased throughput without sacrificing orientation stability.
Data Source
AI summary
Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate. In some cases, embodiments include a substrate including a plurality of wells each having a sidewall where a through hole via extends from a bottom of at least one of the plurality of wells; and a post enhanced diode including a post extending from a top surface of a diode structure.