Semiconductor Package Substrate Wettable Flank Structure
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Solution Overview
Problem
Existing semiconductor package substrates have high process complexity and low precision due to the need for forming through-holes in copper clad laminates, which complicates the manufacturing process and affects the integration and performance of semiconductor devices.
Innovation Solution
A method involving forming grooves or trenches in a conductive base substrate, filling them with resin, curing, and etching to expose the resin, followed by forming a second groove or trench for easier soldering, which simplifies the manufacturing process and improves solder wettability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through-holes are formed in copper clad laminate and plated with metal to electrically connect copper foils, then electrical connection is achieved, but process complexity increases and manufacturing precision decreases
Solution Approach 1:
The patent extracts the complex through-hole formation and plating process from the traditional manufacturing method. Instead of forming through-holes in copper clad laminate and plating them with metal, the invention uses a simplified approach where copper foils are directly connected through the base substrate without requiring through-hole formation and metal plating, thereby reducing process complexity while maintaining electrical connection reliability
Solution Approach 2:
The manufacturing process is segmented into distinct stages: forming grooves in the base substrate, filling with resin, curing, and etching to expose copper foils. This segmentation allows each step to be optimized independently, reducing overall process complexity while ensuring reliable electrical connections between copper foils
2Reliability
If through-holes are formed in copper clad laminate, then electrical connection is achieved, but manufacturing precision decreases
Solution Approach 1:
The patent removes the through-hole formation step from the manufacturing process. Instead of drilling and plating through-holes in copper clad laminate, the invention directly connects copper foils through the base substrate by forming grooves, filling with resin, and etching to expose the copper foils, thereby improving manufacturing precision
Solution Approach 2:
The copper foils are positioned and secured in the base substrate before the final etching step that exposes them. This preliminary positioning ensures precise alignment and connection between copper foils, improving manufacturing precision while maintaining reliable electrical connections
3Ease of manufacture
If traditional manufacturing methods are used for semiconductor package substrates, then substrate structure is formed, but soldering difficulty increases
Solution Approach 1:
The patent applies local quality by creating a wettable flank structure at specific locations on the substrate where soldering is required. This structure has different surface properties compared to other areas, specifically designed to enhance solder wettability and make soldering easier at critical locations while maintaining the overall substrate structure
Solution Approach 2:
The wettable flank structure is formed during the substrate manufacturing process itself, before the soldering operation. By preliminarily creating this structure with enhanced solder wettability, the subsequent soldering operation becomes easier and more reliable, addressing the soldering difficulty issue
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces manufacturing complexity, enhances soldering ease, and improves the precision and performance of semiconductor package substrates by creating a wettable flank structure that facilitates efficient soldering without additional processes.
Implementation Method 1
filling the first grooves or trenches with resin; curing the resin
Data Source
AI summary
Provided are a method of manufacturing a semiconductor package substrate, a semiconductor package substrate manufactured using the method of manufacturing a semiconductor package substrate, a method of manufacturing a semiconductor package, and a semiconductor package manufactured using the method of manufacturing a semiconductor package. The method of manufacturing a semiconductor package substrate includes forming first grooves or first trenches in a bottom surface of a base substrate having a top surface and the bottom surface and formed of a conductive material; filling the first grooves or trenches with resin; curing the resin; removing exposed portions of the resin overfilled in the first grooves or trenches; etching the top surface of the base substrate to expose at least portions of the resin filled in the first grooves or trenches; and forming a second groove or a second trench in the bottom surface of the base substrate.