Protective-Layer Substrate Wetting Control for Firm Adherend Bonding

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing adherend-equipped substrates face issues with adherends not being firmly bonded to protective layers due to large contact angles, leading to mixed air layers and poor adhesion, which can deteriorate underlying layers when the protective layer is removed by laser irradiation.

Innovation Solution

The substrate includes a protective layer with distinct first and second regions, where the first region has a smaller contact angle, allowing for improved adhesion by surface processing to suppress air layer formation, ensuring the adherend is firmly bonded without damaging underlying layers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the protective layer is removed by laser irradiation to expose the underlying layer, then the adherend can be bonded to the exposed underlying layer, but the underlying layer may be cut by laser irradiation which deteriorates its function

Engineering Contradiction:

Improvebonding reliabilityVSAvoidlaser-induced damage to underlying layer

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies preliminary action by performing surface processing on the protective layer before bonding to create a first region with modified surface properties. This preliminary modification enables direct bonding to the protective layer without requiring removal, thus avoiding laser-induced damage to the underlying layer while ensuring reliable adhesion through the processed surface region

Inventive Principle:

Principle #10Preliminary action

2Object-affected harmful factors

If the adherend is bonded to the front face of the protective layer without removing the protective layer, then the underlying layer is protected from laser damage, but a large number of local air layers are mixed in the adhesive layer due to large contact angle which prevents firm bonding

Engineering Contradiction:

Improveprotection from laser damageVSAvoidbonding strength

Core Design Contradiction:

Object-affected harmful factorsVSReliability

Solution Approach 1:

The patent applies local quality by creating a first region on the protective layer with distinct surface properties (smaller contact angle) compared to the rest of the protective layer. This localized surface modification ensures that the adhesive spreads properly and bonds firmly in the first region while the rest of the protective layer maintains its original protective functions

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent applies parameter changes by modifying the contact angle parameter of the protective layer surface through surface processing. The first region is processed to have a smaller contact angle than the unprocessed regions, which fundamentally changes the wetting properties and enables proper adhesive spreading and bonding without air layer entrapment

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables robust bonding of adherends to protective layers with minimal air layer interference, maintaining the integrity of underlying layers and enhancing adhesion strength.

Implementation Method 1

The adherend is bonded to a front face of the substrate with an adhesive

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 2

The front face of the protective layer includes a first region and a second region. The first region is a region to which the adherend is bonded with the adhesive. The first region has a first contact angle. The second region is a region other than the first region and has a second contact angle. The first contact angle is smaller than the second contact angle.

Methodology Applied

Scientific EffectSurface processing:

Data Source

PatentUS20260016920A1Adherend-equipped substrate

Publication Date: 2026.01.15 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

AI summary

An adherend-equipped substrate includes a substrate and an adherend. The adherend is bonded to a front face of the substrate with the adhesive. The substrate includes a substrate body and a protective layer. The protective layer having a front face is disposed at a side of a front face of the substrate body. The front face of the protective layer has a first region and a second region. The first region is a region to which the adherend is bonded with the adhesive. The first region has a first contact angle. The second region is a region other than the first region and has a second contact angle. The first contact angle is smaller than the second contact angle.