Light Emitting Substrate Wiring Layout for Stronger Cover Bonding

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Solution Overview

Problem

Existing light emitting devices face challenges in achieving high joining strength between the substrate and the cover member, which affects the device's durability and performance.

Innovation Solution

A light emitting device design featuring a substrate with specific wiring configurations and a cover member that includes a connection wiring portion with varying widths, allowing for improved contact area and positional precision of light emitting elements, thereby enhancing the joining strength between the substrate and the cover member.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a conventional wiring configuration is used, then the manufacturing process is simple, but the joining strength between substrate and cover member is insufficient

Engineering Contradiction:
Improvejoining strengthVSAvoidwiring configuration complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The connection wiring portion is divided into three distinct sections: a first connection end, a connection central portion, and a second connection end. This segmentation allows each part to serve specific functions - the narrower connection central portion facilitates precise light emitting element placement while the wider connection ends ensure strong electrical and mechanical connections to the wiring portions, thereby resolving the contradiction between simplified manufacturing and enhanced joining strength.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The connection wiring portion features non-uniform width distribution with different maximum widths at different locations. The connection central portion has a smaller maximum width optimized for positioning accuracy, while the connection ends have larger maximum widths optimized for connection strength. This local quality variation allows the single connection wiring portion to simultaneously satisfy both positioning precision and joining strength requirements.

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If the connection wiring portion has uniform width, then the manufacturing process is simpler, but the positional precision of light emitting elements is reduced

Engineering Contradiction:
Improvepositional precisionVSAvoidmanufacturing complexity
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The connection wiring portion is segmented into regions with different width characteristics. The connection central portion is designed with a smaller maximum width to create a precise positioning reference for light emitting elements, while the connection ends maintain larger widths for robust connections. This segmentation achieves high positional precision without requiring complex multi-component structures.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The width parameter of the connection wiring portion is varied along its length to optimize different functional regions. By changing the maximum width from the connection ends to the connection central portion, the design achieves both precise positioning (narrower central portion) and strong connections (wider ends), resolving the contradiction between manufacturing precision and ease of manufacture.

Inventive Principle:
Principle #35Parameter changes

3Strength

If the connection wiring portion is made wider, then the connection strength is improved, but the contact area between base member and cover member is reduced

Engineering Contradiction:
Improveconnection strengthVSAvoidcontact area
Core Design Contradiction:
StrengthVSArea of stationary object

Solution Approach 1:

The connection wiring portion is divided into regions with different width characteristics. The connection ends have larger maximum widths to provide strong connection strength, while the connection central portion has a smaller maximum width to minimize the reduction of contact area between the base member and cover member. This segmentation allows the design to achieve strong connections without excessively compromising the contact area.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The width of the connection wiring portion is locally optimized - wider at the connection ends where connection strength is critical, and narrower at the connection central portion where contact area preservation is more important. This local quality differentiation resolves the contradiction by applying different width characteristics to different functional regions of the same component.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS11948925B2Light emitting device and method of producing light emitting device
Publication Date: 2024.04.02 NICHIA CORP
  • US11948925B2 patent drawing
  • US11948925B2 patent drawing
  • US11948925B2 patent drawing

AI summary

A light emitting device includes a substrate including first, second, third and fourth wiring portions on a top surface of a base member and arrayed in a first direction, and a connection wiring portion connecting the second and third wiring portions. The connection wiring portion includes first and second connection ends respectively connected with the second and third wiring portions, and a connection central portion connecting the first and second connection ends and having a maximum width in a second direction different from each of a maximum width of the first connection end and a maximum width of the second connection end. In the second direction, at least a part of the connection wiring portion has a width narrower than each of a maximum width of the second wiring portion and a maximum width of the third wiring portion.