Substrate Wiring and Conduction Member Layout for Dense Signal Routing
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Solution Overview
Problem
The increasing number of control signals in electronic devices leads to a challenge in forming conduction paths using metal lead frames in a small space, making it difficult to increase integration density.
Innovation Solution
The electronic device employs a substrate with wiring portions and conduction members, where conduction members are joined to first leads through connecting members, allowing for increased integration density by using a block-shaped conduction member with reduced inductance and avoiding short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If metal lead frames are used to form conduction paths, then the device structure is simple and easy to manufacture, but the integration density cannot be increased due to the difficulty of forming thin or high-density conduction paths
Solution Approach 1:
The patent changes the physical parameters of the conduction paths by forming them as thin film wiring portions on a substrate rather than using thick metal lead frames. This parameter change enables higher integration density while maintaining manufacturability through standard thin film fabrication processes.
Solution Approach 2:
The patent replaces the mechanical pressing and etching processes used for metal lead frames with thin film deposition and patterning processes. This substitution enables the formation of thinner and more densely packed conduction paths that cannot be achieved with conventional metal lead frame techniques.
2Adaptability or versatility
If the number of conduction paths is increased to accommodate more control signals, then the control capability is improved, but the device area increases and integration density decreases
Solution Approach 1:
The patent transitions from planar metal lead frame conduction paths to multi-layer thin film wiring structures on a substrate. This dimensional change allows conduction paths to be routed in multiple layers and directions, increasing the number of control signals that can be accommodated within a compact area.
Solution Approach 2:
The patent changes the geometry and distribution parameters of conduction paths by using thin film technology, which allows for finer line widths and closer spacing. This enables increased control capability without proportionally increasing the device area, thereby maintaining high integration density.
3Ease of manufacture
If conventional metal lead frames are used, then the manufacturing process is straightforward, but it is difficult to make conduction paths thin or increase their density
Solution Approach 1:
The patent replaces mechanical pressing and etching with thin film deposition and photolithography processes. This substitution enables precise control of conduction path thickness and spacing, achieving manufacturing precision that cannot be obtained with conventional metal lead frame techniques while maintaining ease of manufacture through standardized semiconductor fabrication processes.
Data Source
AI summary
An electronic device includes: a substrate with obverse and reverse surfaces spaced apart in a thickness direction; an electronic element having an obverse surface formed with a first obverse surface electrode; a wiring portion on the substrate obverse surface and configured to transmit a control signal for the electronic element; a conduction member with obverse and reverse surfaces spaced apart in the thickness direction, where the reverse surface is joined to the wiring portion; a conductive first lead on the substrate obverse surface; and a first connecting member joined to the obverse surface of the conduction member and the first obverse surface electrode. The first lead includes a first pad portion spaced apart from the wiring portion and to which the electronic element is joined. The wiring portion and the first obverse surface electrode are electrically connected to each other via the conduction member and the first connecting member.