Light-Emitting Substrate Wiring Layout for Narrow Display Bezels

The patent changes the wiring arrangement from a two-dimensional planar oblique connection to a three-dimensional multi-layer structure. Conductors are distributed across multiple stacked insulating layers, with conductive patterns on each layer connecting to binding pins through vertical vias. This dimensional transition allows wires to reach binding pins without requiring large horizontal oblique regions, thus reducing the non-display region width while maintaining connection reliability.

The wiring path is segmented into multiple sections across different insulating layers. Instead of a single long oblique conductor, the electrical connection is divided into multiple shorter segments on different layers, connected by vertical vias. This segmentation allows the wiring to bypass the need for large oblique regions while maintaining reliable electrical connections through the stacked structure.

The stacked insulating layer structure serves multiple functions simultaneously: it provides electrical insulation between conductors, establishes vertical electrical connections through vias, and enables compact wiring routing. This multi-functional design reduces wiring complexity by consolidating multiple roles into a unified multi-layer architecture, making the complex wiring manageable and systematic.

The patent changes the structural parameters of the wiring system by introducing multiple insulating layers with different conductor patterns. Instead of using large oblique regions in a single layer, the design uses smaller conductor segments on multiple layers with controlled vertical spacing. This parameter change transforms the wiring approach from horizontal expansion to vertical stacking, reducing the non-display region width while managing complexity through standardized layer construction.