Substrate Support Zone Heating for Real-Time Temperature Control
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Solution Overview
Problem
Current temperature control systems in electronic device manufacturing suffer from inaccurate and delayed temperature measurements due to the limited number of embedded temperature sensors, leading to uneven processing across substrate zones, which results in defects during etching and deposition processes.
Innovation Solution
A method and apparatus that utilize direct current (DC) power to heating elements embedded in substrate support assemblies, where a controller measures voltage and current to determine temperature and adjusts power delivery to achieve target temperatures, enabling real-time and accurate temperature control without the need for separate temperature sensors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If embedded temperature sensors are used to measure substrate temperature, then temperature measurement capability is provided, but measurement accuracy and real-time performance deteriorate due to delays in feedback transmission and insufficient sensor coverage
Solution Approach 1:
The heating element serves dual functions: heating the substrate and sensing its temperature. By measuring the electrical properties (voltage, current, resistance) of the heating element itself, the system obtains real-time temperature data without requiring separate temperature sensors, thereby eliminating feedback delays and improving measurement accuracy.
Solution Approach 2:
The heating element is transformed into a multi-functional component that performs both heating and temperature sensing. This universal application allows the same component to serve multiple purposes, reducing the number of separate components needed and improving the overall measurement system performance.
2Device complexity
If fewer embedded temperature sensors are used than substrate support zones, then device complexity is reduced, but temperature control accuracy deteriorates because one sensor must measure multiple zones
Solution Approach 1:
The substrate support assembly is divided into multiple zones, each with its own heating element. Each heating element can be independently controlled and measured, allowing precise temperature control for each zone without requiring multiple separate temperature sensors, thus maintaining low device complexity while achieving high manufacturing precision.
Solution Approach 2:
Each zone of the substrate support assembly has its own heating element with independent temperature control capability. This local quality approach allows different zones to be controlled at different temperatures as needed, improving overall temperature control accuracy while using the same type of component throughout the system.
3Reliability
If embedded temperature sensors are used instead of heating element measurement, then dedicated temperature sensing is provided, but system complexity and cost increase
Solution Approach 1:
The heating element performs self-diagnosis by measuring its own electrical properties to determine temperature. This self-service capability provides reliable temperature measurement without requiring external temperature sensors, thereby maintaining measurement reliability while reducing system complexity and cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides near-instantaneous and accurate temperature measurements, quickly identifies and corrects temperature deviations, reducing substrate defects and maintaining target temperatures throughout the process, thereby improving overall system accuracy and reducing complexity and costs.
Implementation Method 1
supplying a first direct current (DC) power to a heating element embedded in a zone of a substrate support assembly
Data Source
AI summary
A direct current (DC) power is supplied to heating elements embedded in zones of a substrate support assembly (SSA) of a processing chamber. A determination is made, based on a voltage measured across the heating elements and a current measured through the heating elements as the DC power is supplied to the heating elements, that the temperature of the SSA does not satisfy a temperature condition. A zone of the SSA that is at a temperature that does not correspond to a target temperature for the zone based on the temperature condition is identified based on the measured voltage and the measured current. The DC power supplied to the heating elements embedded within the identified zone is modified to cause the temperature of the zone to be modified to the target temperature and the temperature of the substrate support assembly to satisfy the temperature condition.