Substrate-less IC Packaging with Intermetallic Terminals
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Solution Overview
Problem
Current integrated circuit packaging systems face challenges in reducing package dimensions, increasing functionality, and lowering costs while maintaining reliability, as existing mature technologies do not effectively address the need for smaller, more efficient, and cost-effective solutions.
Innovation Solution
The development of a substrate-less integrated circuit packaging system that includes a terminal with intermetallic compound characteristics, connected to a substrate and encapsulated with a base encapsulation, allowing for reduced profile and improved connectivity, reliability, and simplified manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If mature package technologies with existing manufacturing methods are used, then manufacturing cost is reduced, but package dimensions are not reduced
Solution Approach 1:
The patent transitions from traditional planar packaging to a three-dimensional stacked architecture where multiple integrated circuit packages are vertically arranged and interconnected. This vertical stacking enables significant reduction in the horizontal footprint (package dimensions) while maintaining manufacturing compatibility with existing processes, thus resolving the contradiction between cost reduction and dimension reduction.
Solution Approach 2:
The patent implements a nested structure where substrate-less integrated circuit packages are mounted and connected in a stacked configuration, with each package nested within the vertical space of the overall assembly. This nesting approach maximizes space utilization, reduces the overall package envelope, and maintains ease of manufacture through modular assembly of standardized components.
2Adaptability or versatility
If feature size is reduced to increase circuit density, then functionality is enhanced, but manufacturing obstacles increase
Solution Approach 1:
The patent extracts the substrate from the traditional integrated circuit package structure, creating substrate-less packages. This extraction eliminates the need for complex substrate processing and reduces manufacturing obstacles associated with small feature sizes, while maintaining high circuit density through direct mounting of the active circuit elements.
Solution Approach 2:
Instead of reducing feature size to achieve higher density, the patent inverts the approach by using substrate-less packages that can be directly mounted and stacked. This inversion shifts the density achievement from lateral miniaturization to vertical integration, thereby avoiding the manufacturing obstacles associated with continued feature size reduction.
3Volume of moving object
If package dimensions are reduced, then integration is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent segments the integrated circuit system into multiple discrete substrate-less packages that are manufactured separately and then assembled in a stacked configuration. This segmentation allows each package to be manufactured with standard precision, while the overall system achieves high integration through precise vertical alignment and interconnection of the segmented units during assembly.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: mounting a substrate-less integrated circuit package, having a terminal having characteristics of an intermetallic compound, over a substrate; connecting the substrate and the substrate-less integrated circuit package; and forming a base encapsulation over the substrate-less integrated circuit package with the terminal exposed.