Substrateless IC Packaging via Encapsulant-Conductive Element Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional lead frame-based IC packaging processes are costly, limit design flexibility, hinder miniaturization, and suffer from poor heat dissipation and yield due to their reliance on substrates and fixed plane designs.
Innovation Solution
A substrateless device and manufacturing method that eliminates the need for lead frames or PCBs by using an encapsulant to fix and expose conductive elements, allowing for customizable pin locations and sizes, and incorporating a circuit pattern layer for reduced impedance and enhanced heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If lead frame is used for IC packaging, then device reliability and ease of manufacture are improved, but device size, material cost, and design flexibility deteriorate
Solution Approach 1:
The patent extracts and removes the lead frame substrate from the packaging structure, retaining only the essential conductive elements (pins) needed for electrical connection. This elimination of the bulk lead frame material directly reduces device volume while maintaining the core functionality of electrical connectivity and mechanical support.
Solution Approach 2:
The invention changes the packaging paradigm from a bulk three-dimensional lead frame structure to a planar arrangement of conductive elements on a carrier. This parameter change in structural organization dramatically reduces the volume occupied by the packaging while preserving reliability through proper conductive element design and placement.
2Ease of manufacture
If lead frame is used for IC packaging, then ease of manufacture is improved, but material cost and device complexity deteriorate
Solution Approach 1:
The patent removes the expensive lead frame material (typically copper or copper alloy) and replaces it with a cost-effective carrier substrate and minimal conductive elements. This extraction of unnecessary material directly reduces material cost while the simplified structure actually improves ease of manufacture by reducing assembly steps.
Solution Approach 2:
The invention employs a disposable carrier substrate that is inexpensive and can be easily discarded after serving its purpose of positioning and supporting the conductive elements during manufacturing. This approach significantly reduces material cost compared to traditional lead frames while maintaining manufacturing simplicity.
3Ease of manufacture
If lead frame is used for IC packaging, then ease of manufacture is improved, but design flexibility and adaptability deteriorate
Solution Approach 1:
The patent creates a dynamic and flexible design system where the carrier substrate and conductive elements can be easily reconfigured for different device layouts. This dynamic structure allows rapid adaptation to various design requirements without requiring complete redesign of the packaging system, thereby enhancing design flexibility while maintaining ease of manufacture through standardized processes.
Solution Approach 2:
The invention enables easy modification of pin locations, pin numbers, and electrical connection configurations by simply changing the conductive element arrangement on the carrier. This parameter flexibility allows the same manufacturing process to produce diverse device designs, greatly improving adaptability while keeping the manufacturing process simple and standardized.
4Ease of manufacture
If conventional molding process is used, then ease of manufacture is improved, but heat dissipation performance and productivity deteriorate
Solution Approach 1:
The patent extracts the heat dissipation function from the bulk lead frame material and implements it through dedicated thermal management structures, including thermally conductive adhesive layers and direct bonding to heat sinks. This separation of functions allows optimized heat dissipation pathways while maintaining the simplicity of the molding process.
Solution Approach 2:
The invention employs composite material structures with different thermal conductivities arranged in specific configurations to enhance heat dissipation. The combination of carrier substrate, adhesive layers, and conductive elements creates efficient thermal pathways that improve heat dissipation performance while the overall structure remains compatible with conventional molding processes.
5Ease of manufacture
If lead frame is used for IC packaging, then ease of manufacture is improved, but manufacturing yield deteriorates
Solution Approach 1:
The patent removes the lead frame structure that is prone to deformation, warping, and manufacturing defects. By eliminating this problematic component and using a more stable carrier substrate with precisely positioned conductive elements, the invention reduces manufacturing variability and improves yield while keeping the process simple.
Solution Approach 2:
The invention replaces the mechanical lead frame structure with a more stable and predictable system based on precise positioning on the carrier substrate. This substitution reduces mechanical issues such as warping and misalignment during manufacturing, thereby improving yield without complicating the manufacturing process.
Data Source
AI summary
A substrateless device comprises a plurality of first conductive elements and an encapsulant. The encapsulant encapsulates the plurality of first conductive elements, wherein the locations of the plurality of first conductive elements are fixed by the encapsulant; and a plurality of terminals of the plurality of first conductive elements are exposed outside the encapsulant, wherein the plurality of first conductive elements are not supported by a substrate.