Subsurface Geothermal Cooling for High-Density Computer Hardware

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Solution Overview

Problem

High cooling costs in data centers due to significant heat generated by computer hardware, which existing cooling methods are unable to efficiently address, especially in high-density configurations.

Innovation Solution

A geothermal cooling mechanism for computer hardware systems installed in subsurface environments, utilizing direct contact or a heat-transporting fluid to transfer thermal energy from the hardware to the earth's underground or a large body of water, optimizing heat dissipation through passive or forced circulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If traditional above-ground cooling methods are used for high-density computer hardware, then the hardware can operate, but cooling costs become excessively high and heat dissipation efficiency is insufficient

Engineering Contradiction:
Improvecooling costVSAvoidheat dissipation efficiency
Core Design Contradiction:
Loss of energyVSTemperature

Solution Approach 1:

The patent moves the computer hardware from above-ground environment to subsurface environment (below ground), utilizing the third dimension (depth) to access the earth's natural cooling capacity. The containment vessel is installed in a borehole or excavation at a depth where the earth maintains a relatively constant, cool temperature, thereby passively reducing the cooling load without requiring additional energy input.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The earth's subsurface environment provides natural cooling through its constant temperature at depth, eliminating the need for active cooling systems. The geothermal environment serves itself by absorbing heat from the hardware through thermal conduction and convection in the surrounding soil or water, reducing energy consumption for cooling.

Inventive Principle:
Principle #25Self-service

2Volume of moving object

If heat-generating electronic components are installed in high-density configurations, then space utilization improves, but heat accumulation increases and cooling becomes more difficult

Engineering Contradiction:
Improvespace utilizationVSAvoidheat accumulation
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

A cooling fluid (water or other heat transfer fluid) is introduced as an intermediary between the heat-generating hardware and the surrounding earth. The fluid circulates through channels in the containment vessel or surrounding soil, absorbing heat from the hardware and transporting it to the broader geothermal environment, thereby enabling effective heat dissipation in high-density configurations.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs hydraulic circulation of cooling fluid through the subsurface environment. Pumps circulate water through pipes or channels surrounding the containment vessel or within the borehole, utilizing fluid dynamics to efficiently transfer heat from the high-density hardware to the geothermal reservoir, enabling scalable heat removal.

Inventive Principle:
Principle #29Pneumatics and hydraulics

3Temperature

If active cooling systems are installed to manage heat, then temperature control improves, but system complexity and maintenance requirements increase

Engineering Contradiction:
Improvetemperature controlVSAvoidcooling system complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The subsurface geothermal environment provides passive cooling through natural thermal conduction and convection. The earth at depth maintains a constant temperature and naturally absorbs heat from the hardware without requiring active refrigeration cycles, compressors, or complex control systems, thereby simplifying the overall cooling infrastructure.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The patent extracts the heat management function from the traditional active cooling system and relocates it to the passive geothermal environment. By moving the hardware subsurface and utilizing the earth's natural thermal properties, the system eliminates the need for complex above-ground cooling equipment, reducing maintenance and operational complexity.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces operating costs and extends the operational lifetime of hardware by maintaining lower average temperatures and providing a secure, high-capacity cooling solution, eliminating the need for traditional above-ground cooling methods.

Implementation Method 1

direct contact or a heat-transporting fluid to transfer thermal energy from the hardware to the earth's underground

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

optimizing heat dissipation through passive or forced circulation

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS9593876B2Cooling electronic devices installed in a subsurface environment
Publication Date: 2017.03.14 SMITH DAVID
  • US9593876B2 patent drawing
  • US9593876B2 patent drawing
  • US9593876B2 patent drawing

AI summary

An apparatus and method for cooling of electronic equipment, for example a computer system, in a subsurface environment including a containment vessel in at least partial contact with subsurface liquid or solid material. The containment vessel may be disposed in a variety of subsurface environments, including boreholes, man-made excavations, subterranean caves, as well as ponds, lakes, reservoirs, oceans, or other bodies of water. The containment vessel may be installed with a subsurface configuration allowing for human access for maintenance and modification. Geothermal cooling is achieved by one or more fluids circulating inside and/or outside the containment vessel, with a variety of configurations of electronic devices disposed within the containment vessel. The circulating fluid(s) may be cooled in place by thermal conduction or by active transfer of the fluid(s) out of the containment vessel to an external, possibly geothermal, heat exchange mechanism, then back into the containment vessel.