Subsystem-Based SoC Integration for Chassis Validation
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Solution Overview
Problem
The complexity of integrating multiple components in System on Chip (SoC) designs leads to manufacturing and testing challenges due to the lack of validated Intellectual Property blocks against a chassis, resulting in inefficient and error-prone processes.
Innovation Solution
The approach involves packaging logic components into subsystems with well-defined interfaces, allowing for validation and integration into a compatible SoC chassis, reducing the number of components and streamlining the design process by creating reusable collateral that covers aspects beyond Register Transfer Level integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple electronic components are packaged on the same SoC to save physical space, then space efficiency is improved, but integration complexity and manufacturing difficulty increase
Solution Approach 1:
The patent divides the SoC into independent subsystems (e.g., image processing subsystem, audio processing subsystem, video processing subsystem) each with well-defined interfaces. This segmentation allows complex functionality to be distributed across manageable modules that can be validated and tested independently, reducing overall integration complexity while maintaining space efficiency.
Solution Approach 2:
The patent implements preliminary validation of each subsystem against a chassis model before final integration. This preliminary action identifies and resolves interface compatibility issues, timing conflicts, and resource conflicts in advance, reducing the complexity of the final integration process and enabling smoother assembly of multiple components on a single chip.
2Adaptability or versatility
If multiple packages are used to provide additional functionality, then functional capability is improved, but physical space and interconnection complexity increase
Solution Approach 1:
The patent merges multiple previously separate packages into a single SoC by integrating multiple subsystems (image processing, audio processing, video processing) onto one chip. This combining approach maintains all required functional capabilities while eliminating the need for multiple separate packages and their associated interconnection wiring, thereby reducing physical space requirements.
3Productivity
If Intellectual Property blocks are integrated without chassis validation, then integration speed is improved, but reliability and issue rate deteriorate
Solution Approach 1:
The patent performs preliminary validation of each Intellectual Property block against a detailed chassis model before final integration. This preliminary validation action checks for interface compatibility, timing conflicts, and resource conflicts in advance, ensuring reliable integration while maintaining efficient integration speeds through automated validation processes.
4Reliability
If detailed validation of subsystems is performed, then component quality is improved, but integration time increases
Solution Approach 1:
The patent performs detailed validation of subsystems against the chassis model as a preliminary action before final integration. By completing this validation in advance, the actual integration process becomes faster and more straightforward, as interface compatibility and potential conflicts have already been identified and resolved. This approach improves component quality while minimizing time loss during integration.
Data Source
AI summary
Methods and apparatus relating to subsystem-based System on Chip (SoC) integration are described. In one embodiment, logic circuitry determines one or more components of a subsystem. The subsystem supports an architectural feature to be implemented on a System on Chip (SoC) device. A first interface communicatively couples a first component of the subsystem to a first component of another subsystem. A second interface communicatively couples at least one component of the subsystem to at least one chassis component of the SoC device or communicatively couples the at least one component of the subsystem to at least one non-chassis component of the other subsystem. In an embodiment, components of the subsystem may be packaged such that the packaging generates a reusable collateral that allows for fast integration of all aspects of design in any SoC device with a compatible chassis prior to manufacture.