Suction Array Layouts for Non-Standard Substrate Holding

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Solution Overview

Problem

Conventional printing technologies face challenges in holding down substrates with non-standard or complex shapes during printing, leading to issues like edge lifting and inefficient use of suction power, which can interfere with printing quality and require bespoke equipment for different shapes.

Innovation Solution

A method and system that use a processor to determine a tailored suction array layout with operative and non-operative vacuum holes, where a sealing sheet is applied to render non-operative holes non-functional, allowing the same printer to handle various shapes by adjusting the suction array layout for each substrate, ensuring secure holding and efficient suction power utilization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional vacuum platen with uniform suction holes is used, then substrates with standard shapes can be held down, but substrates with non-standard or complex shapes experience edge lifting and incomplete surface contact

Engineering Contradiction:
Improveholding reliabilityVSAvoidshape adaptability
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The vacuum platen is segmented into multiple zones with different suction hole patterns. Each zone can be independently controlled with different vacuum levels, allowing the platen to adapt to different substrate shapes and sizes while maintaining reliable holding across the entire surface.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The suction array layout is made dynamic and adjustable rather than fixed. The system can reconfigure which suction holes are active and at what vacuum level based on the detected substrate shape, enabling the same platen to reliably hold various non-standard shapes without physical modification.

Inventive Principle:
Principle #15Dynamics

2Area of stationary object

If suction holes are distributed across the entire platen surface, then coverage is maximized, but suction power is wasted on areas outside the substrate boundary

Engineering Contradiction:
Improvesuction coverage areaVSAvoidsuction power efficiency
Core Design Contradiction:
Area of stationary objectVSLoss of energy

Solution Approach 1:

Different regions of the platen are assigned different suction characteristics. Suction holes located at or near the substrate boundary receive higher vacuum levels or are preferentially activated, while holes in non-critical areas operate at lower levels or remain inactive, optimizing power efficiency without sacrificing holding reliability.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The vacuum level parameter is varied spatially across the platen surface based on substrate geometry. By adjusting the vacuum parameter locally rather than uniformly, the system maximizes suction effectiveness at critical areas (edges and corners) while minimizing energy consumption in less critical zones.

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If bespoke vacuum platens are designed for each substrate shape, then printing quality is optimized, but device complexity and cost increase

Engineering Contradiction:
Improveprinting qualityVSAvoidequipment complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

A single vacuum platen design serves multiple substrate shapes and sizes through programmable control of the suction array. The platen contains more suction holes than any single substrate requires, and software control determines which holes are active based on substrate geometry, eliminating the need for multiple bespoke platens while maintaining printing quality.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

Instead of creating physical copies of substrate-specific platens, the system uses digital models of substrate shapes to generate corresponding suction array configurations. The software copies the substrate geometry information and translates it into activation patterns for the suction holes, achieving shape-specific optimization without physical customization.

Inventive Principle:
Principle #26Copying

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables reliable printing of substrates with non-standard shapes by ensuring complete surface contact and optimizing suction power, allowing a single printer to efficiently handle multiple shapes without the need for complex bespoke equipment.

Implementation Method 1

a plurality of vacuum holes arranged according to the suction array layout. The array of vacuum holes may be formed in the media support in order to form a vacuum platen

Methodology Applied
Scientific EffectVacuum suction: Suction

Data Source

PatentUS11279150B2Suction array layouts
Publication Date: 2022.03.22 HP SCITEX LTD
  • US11279150B2 patent drawing
  • US11279150B2 patent drawing
  • US11279150B2 patent drawing

AI summary

In an example, there is provided a method including: receiving, at a processor, data specifying the shape of a blank to form a folded article; and determining, using the processor, based on the received data, a suction array layout to hold the blank against a media support, wherein the suction array layout conforms to the shape of the blank.