Suction Apparatus Base Isolation for Wafer Grinding Stability
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Solution Overview
Problem
The existing grinding apparatus and suction apparatus systems face challenges with vibrations transmitted from the suction apparatus to the grinding apparatus, leading to defects such as breakage or chipping of the wafer during processing.
Innovation Solution
The proposed solution involves a processing equipment setup with a processing apparatus and a suction apparatus, where the suction apparatus is supported by a second base with leg parts that can extend and contract. This allows the suction apparatus to stand independently during installation and be supported by the processing apparatus's base during conveyance, reducing vibration transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the suction apparatus is disposed in the grinding apparatus and secured to the grinding apparatus, then the connection work can be omitted and the time and effort of packing can be reduced, but vibrations generated in the suction apparatus are transmitted to the grinding apparatus causing defects such as breakage or chipping of the wafer
Solution Approach 1:
A vibration isolation mechanism is introduced as an intermediary element between the suction apparatus and the grinding apparatus. This mechanism includes elastic elements or damping structures that absorb and attenuate vibrations from the suction apparatus before they can be transmitted to the grinding apparatus, thereby protecting the wafer from vibration-induced defects while maintaining the integrated configuration
2Loss of time
If the suction apparatus is disposed in the grinding apparatus, then the time and effort of packing can be reduced, but vibrations generated in the suction apparatus are transmitted to the grinding apparatus
Solution Approach 1:
The vibration isolation mechanism serves as a mediator that allows the suction apparatus to be permanently integrated with the grinding apparatus (reducing packing time) while simultaneously blocking the transmission path of vibrations to the grinding apparatus, thus resolving the contradiction between ease of deployment and vibration protection
3Device complexity
If the suction apparatus is disposed in the grinding apparatus, then the grinding apparatus and suction apparatus can be conveyed as a single unit, but vibrations generated in the suction apparatus are transmitted to the grinding apparatus
Solution Approach 1:
By introducing the vibration isolation mechanism as an intermediary, the system achieves simplified integrated conveyance of the grinding apparatus and suction apparatus as a single unit, while the vibration isolation components actively prevent harmful vibration transmission to the grinding apparatus and wafer
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces vibrations transmitted from the suction apparatus to the grinding apparatus, minimizing the risk of wafer defects and improving the overall processing stability and efficiency.
Implementation Method 1
a suction apparatus supplying a negative pressure to the chuck table
Implementation Method 2
multiple leg parts that are disposed in such a manner as to penetrate through through-holes provided in the first base, without getting contact with the first base, and are each capable of extension and contraction
Data Source
AI summary
Processing equipment includes a processing apparatus including a chuck table, a suction apparatus supplying a negative pressure to the chuck table, a first base that supports the processing apparatus, and a second base that supports the suction apparatus. The second base has, at a bottom part thereof, multiple leg parts that are disposed in such a manner as to penetrate through through-holes provided in the first base, without getting contact with the first base, and are each capable of extension and contraction. The second base is allowed to be supported by the first base through contracting of each of the multiple leg parts when the processing and suction apparatuses are to be conveyed. The second base stands by itself without getting contact with the first base, through extending of each of the multiple leg parts when the processing and suction apparatuses are to be installed on a floor surface.